EPF6016QC208-2

Introducing the EPF6016QC208-2, a high-performance programmable logic device designed to meet the demanding requirements of modern electronic systems. This versatile device offers a wide range of features and capabilities, making it an ideal choice for a variety of applications. The EPF6016QC208-2 features a 16,000 logic cell capacity and a total of 208 pins, providing ample room for complex designs. Its programmable architecture allows for easy customization, enabling designers to create unique solutions tailored to their specific needs. With an operating voltage range of 3.3V, this device ensures compatibility with a wide range of system components. It also offers high-speed performance, with support for speeds of up to 200 MHz, making it suitable for applications that require real-time processing. The EPF6016QC208-2 is equipped with various I/O options, including LVCMOS, LVTTL, and PCI, providing flexibility in connecting to external devices. It also features abundant memory resources, including both flip-flops and embedded memory blocks, further enhancing its versatility. Overall, the EPF6016QC208-2 is a powerful and flexible solution for designers looking to create advanced electronic systems. Its wide range of features, high-speed performance, and programmable architecture make it a reliable choice for a variety of applications.

banner

Other Products

View More
  • 501HAJ-ABAG-ND

    501HAJ-ABAG-ND

  • SG-9101CA-C02PHCBA-ND

    SG-9101CA-C02PHCBA-ND

  • 591TD-ADG-ND

    591TD-ADG-ND

  • SG-8002DB-STC-ND

    SG-8002DB-STC-ND

  • 503CBB-ACAG-ND

    503CBB-ACAG-ND

  • SG-9101CG-D40PGBCC-ND

    SG-9101CG-D40PGBCC-ND

  • SG-9101CE-D20PHAAA-ND

    SG-9101CE-D20PHAAA-ND

  • 503EAB-ACAG-ND

    503EAB-ACAG-ND

  • 501JBC-ACAF-ND

    501JBC-ACAF-ND

  • 501CAF-ACAG-ND

    501CAF-ACAG-ND

  • CPPC7-LT0PP-ND

    CPPC7-LT0PP-ND

  • SG-9101CB-C10SGDAB-ND

    SG-9101CB-C10SGDAB-ND

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close