EPM7128AETC100-7

Introducing the EPM7128AETC100-7, a high-performance configurable logic device designed to revolutionize your digital system designs. This product is part of the MAX 7000A CPLD family and offers a cost-effective and flexible solution for various applications. With 128 macrocells, the EPM7128AETC100-7 provides ample resources for efficiently implementing complex logic functions. It features advanced architecture and innovative technologies, enabling faster and more reliable performance. Operating at a maximum frequency of 116.9 MHz, this device ensures speedy execution of your design. The EPM7128AETC100-7 incorporates 7.5 ns pin-to-pin delay, making it suitable for time-critical applications. It offers reprogrammability, allowing you to modify and upgrade the device during development without requiring costly hardware changes. Additionally, with a user-friendly programming interface, this device offers easy integration with existing systems. This CPLD device boasts low power consumption, minimizing the energy requirements of your digital system. It also features a variety of I/O standards, ensuring compatibility with different interface requirements. The EPM7128AETC100-7 is an excellent choice for applications such as consumer electronics, telecommunications, and industrial control systems. Experience the power and versatility of the EPM7128AETC100-7 and elevate your digital system designs to new heights.

banner

Other Products

View More
  • Intel 5CSEMA2U23C6N

    Intel 5CSEMA2U23C6N

  • Intel AGFA019R25A2E4F

    Intel AGFA019R25A2E4F

  • Intel AGFA008R24C2E4X

    Intel AGFA008R24C2E4X

  • AMD XCZU49DR-2FSVF1760I

    AMD XCZU49DR-2FSVF1760I

  • Broadcom Limited BCM33843MRKFSBGB0T

    Broadcom Limited BCM33843MRKFSBGB0T

  • AMD XCVM1302-2MLEVSVD1760

    AMD XCVM1302-2MLEVSVD1760

  • AMD XCZU46DR-2FSVH1760I

    AMD XCZU46DR-2FSVH1760I

  • AMD XCVM1302-1LLINBVB1024

    AMD XCVM1302-1LLINBVB1024

  • Intel AGFB019R31C2E3E

    Intel AGFB019R31C2E3E

  • Intel 1SX250HH3F55E2VG

    Intel 1SX250HH3F55E2VG

  • Intel AGFC019R25A3I3E

    Intel AGFC019R25A3I3E

  • AMD XCVE1752-2MLENSVG1369

    AMD XCVE1752-2MLENSVG1369

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close