EPM7128AETC100-7

Introducing the EPM7128AETC100-7, a high-performance configurable logic device designed to revolutionize your digital system designs. This product is part of the MAX 7000A CPLD family and offers a cost-effective and flexible solution for various applications. With 128 macrocells, the EPM7128AETC100-7 provides ample resources for efficiently implementing complex logic functions. It features advanced architecture and innovative technologies, enabling faster and more reliable performance. Operating at a maximum frequency of 116.9 MHz, this device ensures speedy execution of your design. The EPM7128AETC100-7 incorporates 7.5 ns pin-to-pin delay, making it suitable for time-critical applications. It offers reprogrammability, allowing you to modify and upgrade the device during development without requiring costly hardware changes. Additionally, with a user-friendly programming interface, this device offers easy integration with existing systems. This CPLD device boasts low power consumption, minimizing the energy requirements of your digital system. It also features a variety of I/O standards, ensuring compatibility with different interface requirements. The EPM7128AETC100-7 is an excellent choice for applications such as consumer electronics, telecommunications, and industrial control systems. Experience the power and versatility of the EPM7128AETC100-7 and elevate your digital system designs to new heights.

banner

Other Products

View More
  • Intel 5CSEMA2U23C6N

    Intel 5CSEMA2U23C6N

  • Intel AGFA019R25A2E4F

    Intel AGFA019R25A2E4F

  • Intel AGFA008R24C2E4X

    Intel AGFA008R24C2E4X

  • AMD XCZU49DR-2FSVF1760I

    AMD XCZU49DR-2FSVF1760I

  • Broadcom Limited BCM33843MRKFSBGB0T

    Broadcom Limited BCM33843MRKFSBGB0T

  • AMD XCVM1302-2MLEVSVD1760

    AMD XCVM1302-2MLEVSVD1760

  • AMD XCZU46DR-2FSVH1760I

    AMD XCZU46DR-2FSVH1760I

  • AMD XCVM1302-1LLINBVB1024

    AMD XCVM1302-1LLINBVB1024

  • Intel AGFB019R31C2E3E

    Intel AGFB019R31C2E3E

  • Intel 1SX250HH3F55E2VG

    Intel 1SX250HH3F55E2VG

  • Intel AGFC019R25A3I3E

    Intel AGFC019R25A3I3E

  • AMD XCVE1752-2MLENSVG1369

    AMD XCVE1752-2MLENSVG1369

Related Blogs

  • 2026 / 05 / 15

    Tower Semiconductor Secures $1.3 Billion Silicon Photonics Order

    Tower Semiconductor lands $1.3B silicon photonics deal for 2027, locking AI data center demand. Scaling CPO & optical interconnect capacity....

    Tower Semiconductor Secures $1.3 Billion Silicon Photonics Order
  • 2026 / 05 / 14

    New Products from ST: High-Precision Op Amp and Ultra-Low-Power Image Sensors

    ST launches TSB192 precision dual op-amp with 20µV offset and 8MHz bandwidth, alongside VD55G4/VD65G4 ultra-low-power global-shutter image sensors in the BrightSense family....

    New Products from ST: High-Precision Op Amp and Ultra-Low-Power Image Sensors
  • 2026 / 05 / 13

    Cmsemicon Advances Memory Portfolio: CMS25Q32A Mass Production Imminent

    Cmsemicon CMS25Q32A 32 Mbit SPI NOR Flash completes mass-production qualification, expanding its MCU-plus memory lineup for embedded, IoT and smart hardware....

    Cmsemicon Advances Memory Portfolio: CMS25Q32A Mass Production Imminent
  • 2026 / 05 / 12

    Analysis and Selection Guide for Popular Electronic Components in May

    Driven by AI, EVs, and automation, demand surges for core components like MCUs, memory, PMICs, and RF chips in May 2026. This guide analyzes popular parts for selection....

    Analysis and Selection Guide for Popular Electronic Components in May
  • 2026 / 05 / 11

    Selection Guide: In-Depth Analysis of Voltage Reference ICs

    Voltage Reference ICs deliver ultra-stable, precision voltage outputs essential for ADC/DAC accuracy. Key specs include initial accuracy, temperature coefficient, and low-frequency noise. ...

    Selection Guide: In-Depth Analysis of Voltage Reference ICs
  • 2026 / 05 / 09

    Google Tensor G7 Chip: Continues with 2nm Process

    Google's upcoming Tensor G7 chip, manufactured by TSMC on a 2nm process, is set to power the Pixel 12 series. It continues Google's AI-first design philosophy......

    Google Tensor G7 Chip: Continues with 2nm Process
  • 2026 / 05 / 08

    Industry Restructuring: ICE Automakers Divest Non-Core Manufacturing Assets

    Global ICE automakers are divesting non-core manufacturing assets, while Chinese EV makers capitalize by acquiring idle overseas capacity to accelerate expansion....

    Industry Restructuring: ICE Automakers Divest Non-Core Manufacturing Assets
  • 2026 / 05 / 07

    Samsung Completely Exits the Chinese Home Appliance Market

    Samsung exits China's home appliance market effective May 6, 2026, halting sales of TVs, refrigerators, and more, while keeping its smartphone business. ...

    Samsung Completely Exits the Chinese Home Appliance Market
  • 2026 / 05 / 04

    Modern Electronics Core: A Guide to CMOS Logic Gate ICs

    CMOS logic gate ICs form the foundation of digital circuits. They use complementary MOSFET pairs for near-zero static power, high noise immunity, and versatile voltage operation....

    Modern Electronics Core: A Guide to CMOS Logic Gate ICs
  • 2026 / 04 / 30

    Amazon Rises to Top Three in Global Data Center Chip Market

    Amazon has become a top-three data center chip designer, with its in-house semiconductor business now generating over $20B annually....

    Amazon Rises to Top Three in Global Data Center Chip Market
Contact Information
close