EPM7128AETC144-5

Introducing the EPM7128AETC144-5, a powerful programmable logic device that boasts unparalleled performance and versatility. This advanced product combines innovative technology with cutting-edge features, making it the ideal solution for a wide range of applications. With its 128 macrocells and 5ns maximum pin-to-pin delay, the EPM7128AETC144-5 offers exceptional speed and efficiency. It features a high-speed memory, allowing for rapid data transfer and processing. The device also offers enhanced flexibility, with a multitude of programming options and extensive I/O capabilities. Designed for ease of use, the EPM7128AETC144-5 is compatible with popular design software, ensuring a seamless integration into existing systems. Its compact size and low power consumption make it perfect for space-constrained and battery-powered applications. Whether you are designing complex digital systems, implementing custom logic functions, or developing innovative solutions, the EPM7128AETC144-5 is the ultimate choice. Experience the power of this versatile programmable logic device and take your designs to new heights.

banner

Other Products

View More
  • Analog Devices Inc./Maxim Integrated MAX6250BCSA-T

    Analog Devices Inc./Maxim Integrated MAX6250BCSA-T

  • Texas Instruments LMV431BIMFX

    Texas Instruments LMV431BIMFX

  • Analog Devices Inc./Maxim Integrated MAX6225BESA+

    Analog Devices Inc./Maxim Integrated MAX6225BESA+

  • Texas Instruments LM336BMX-2.5/NOPB

    Texas Instruments LM336BMX-2.5/NOPB

  • onsemi LM285Z-1.2

    onsemi LM285Z-1.2

  • Diodes Incorporated LF431OCRPA

    Diodes Incorporated LF431OCRPA

  • Analog Devices Inc. LTC6655BHMS8-4.096#PBF

    Analog Devices Inc. LTC6655BHMS8-4.096#PBF

  • Texas Instruments TL431AQDBVTG4

    Texas Instruments TL431AQDBVTG4

  • Analog Devices Inc. ADR421BRZ

    Analog Devices Inc. ADR421BRZ

  • Texas Instruments REF2025QDDCRQ1

    Texas Instruments REF2025QDDCRQ1

  • Analog Devices Inc. ADR520BKS-R2

    Analog Devices Inc. ADR520BKS-R2

  • Texas Instruments LM4050QCIM3X10/NOPB

    Texas Instruments LM4050QCIM3X10/NOPB

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close