EPM7128AETI144-7N

Introducing the EPM7128AETI144-7N, an advanced and versatile programmable logic device that combines high performance with exceptional flexibility. Designed by leading industry experts, this cutting-edge FPGA offers a wide range of features and capabilities to meet the demanding requirements of today's complex digital designs. Featuring 12,000 usable gates, this device provides ample resources to implement intricate logic functions and algorithms. With a programmable interconnect matrix, users can easily customize the routing paths, enabling rapid prototyping and efficient system integration. The EPM7128AETI144-7N boasts a robust architecture that supports various reconfigurable elements, such as registers, counters, and memory blocks, to fulfill diverse application needs. Its low power consumption and fast operating speeds make it ideal for power-sensitive and time-critical applications. Moreover, the EPM7128AETI144-7N is equipped with in-system programmability, allowing for easy updates and modifications without the need for physical component replacement. This ensures greater flexibility, reducing time-to-market and overall development costs. Whether you are designing for communications, industrial control systems, or automotive applications, the EPM7128AETI144-7N delivers the performance, reliability, and versatility you need to bring your designs to life. Explore the possibilities and revolutionize your digital designs with this exceptional programmable logic device.

banner

Other Products

View More
  • Analog Devices Inc./Maxim Integrated DS1135LU-30

    Analog Devices Inc./Maxim Integrated DS1135LU-30

  • Analog Devices Inc./Maxim Integrated DS1135Z-25+T&R

    Analog Devices Inc./Maxim Integrated DS1135Z-25+T&R

  • Analog Devices Inc./Maxim Integrated DS1045S-4+T&R

    Analog Devices Inc./Maxim Integrated DS1045S-4+T&R

  • Analog Devices Inc./Maxim Integrated DS1033Z-10

    Analog Devices Inc./Maxim Integrated DS1033Z-10

  • Analog Devices Inc. LTC6994CS6-2#TRMPBF

    Analog Devices Inc. LTC6994CS6-2#TRMPBF

  • Analog Devices Inc./Maxim Integrated MXD1013SA075

    Analog Devices Inc./Maxim Integrated MXD1013SA075

  • Analog Devices Inc./Maxim Integrated DS1013M-75

    Analog Devices Inc./Maxim Integrated DS1013M-75

  • Analog Devices Inc./Maxim Integrated DS1100LZ-200+

    Analog Devices Inc./Maxim Integrated DS1100LZ-200+

  • ADSANTEC ASNT5072

    ADSANTEC ASNT5072

  • Analog Devices Inc./Maxim Integrated DS1100U-125/T&R

    Analog Devices Inc./Maxim Integrated DS1100U-125/T&R

  • Analog Devices Inc./Maxim Integrated DS1013S-15+

    Analog Devices Inc./Maxim Integrated DS1013S-15+

  • Analog Devices Inc./Maxim Integrated DS1013S-60

    Analog Devices Inc./Maxim Integrated DS1013S-60

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close