ESDU5V0AE1

Introducing the ESDU5V0AE1, the ultimate solution for protecting your electronic devices from electrostatic discharge (ESD) damage. Designed with the latest in ESD protection technology, this product is guaranteed to keep your valuable electronics safe and secure. Featuring a 5V working voltage, the ESDU5V0AE1 is suitable for a wide range of applications, including smartphones, tablets, computers, and more. It is capable of handling up to 17A of peak pulse current, ensuring that even the most powerful ESD events are effectively controlled. The ESDU5V0AE1 is engineered with low leakage current, enabling it to provide continuous protection without interfering with the normal operation of your devices. Its compact and lightweight design allows for easy integration into any electronic system, making it a must-have for any design engineer. Don't let ESD damage ruin your expensive electronics. Invest in the ESDU5V0AE1 and enjoy peace of mind knowing that your devices are protected by the best in the industry. Trust in our proven track record of excellence and make the ESDU5V0AE1 your go-to solution for ESD protection.

banner

Other Products

View More
  • Texas Instruments SN74LV240ADBRG4

    Texas Instruments SN74LV240ADBRG4

  • National Semiconductor 54ACT374FM-MLS

    National Semiconductor 54ACT374FM-MLS

  • NXP USA Inc. PCA9306GM,125

    NXP USA Inc. PCA9306GM,125

  • Fairchild Semiconductor 74AC32PC

    Fairchild Semiconductor 74AC32PC

  • Nexperia USA Inc. 74AHCT86PW,112

    Nexperia USA Inc. 74AHCT86PW,112

  • IDT, Integrated Device Technology Inc 74ALVCH16646APA

    IDT, Integrated Device Technology Inc 74ALVCH16646APA

  • Texas Instruments SN74CBTD3306D

    Texas Instruments SN74CBTD3306D

  • Fairchild Semiconductor 74LCXP16245MEA

    Fairchild Semiconductor 74LCXP16245MEA

  • IDT, Integrated Device Technology Inc 74FCT521ZATQ

    IDT, Integrated Device Technology Inc 74FCT521ZATQ

  • Texas Instruments SN74CBTLV3251DBQR

    Texas Instruments SN74CBTLV3251DBQR

  • Texas Instruments SN74CBTLV3383PWR

    Texas Instruments SN74CBTLV3383PWR

  • NXP USA Inc. 74HC670DB,112

    NXP USA Inc. 74HC670DB,112

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close