LBC807-25LT1G

Introducing the LBC807-25LT1G, a high-performance NPN Bipolar Junction Transistor designed to deliver superior performance and reliability in a compact package. This transistor is the ideal choice for a wide range of applications, including amplification, switching, and voltage regulation. The LBC807-25LT1G is built with advanced semiconductor technology, ensuring low power dissipation and excellent thermal stability. With a maximum power dissipation of 400mW, it can handle high current and voltage requirements with ease. This transistor features a high collector current rating of 500mA, making it suitable for demanding applications. Its low collector-emitter saturation voltage guarantees efficient operation at various load conditions. Furthermore, the LBC807-25LT1G is housed in an SOT-23 surface mount package, making it easy to integrate into existing circuit designs while saving valuable board space. With its outstanding performance, compact size, and versatility, the LBC807-25LT1G is the perfect choice for engineers and designers looking for a reliable transistor solution in a wide range of electronic applications. Upgrade your designs with confidence using the LBC807-25LT1G transistor.

banner

Other Products

View More
  • 1601-30655-ND

    1601-30655-ND

  • 1601-1434-ND

    1601-1434-ND

  • 1601-38649-ND

    1601-38649-ND

  • 1601-1436-ND

    1601-1436-ND

  • 1601-32733-ND

    1601-32733-ND

  • 1601-30663-ND

    1601-30663-ND

  • 1601-30649-ND

    1601-30649-ND

  • 1601-30651-ND

    1601-30651-ND

  • 1601-1435-ND

    1601-1435-ND

  • 1601-1437-ND

    1601-1437-ND

  • 1601-1438-ND

    1601-1438-ND

Related Blogs

  • 2026 / 03 / 31

    Omron Divests Core Electronic Components Business

    Omron divests its founding Device & Module Solutions business to Carlyle for ¥81 billion. The electronic components unit will become independent via a two-phase transaction in 2026, allowing OMRON to focus on industrial automation....

    Omron Divests Core Electronic Components Business
  • 2026 / 03 / 30

    Apple to Integrate YMTC NAND Flash, Exclusively for China Market

    Apple partners with YMTC to integrate China-made NAND flash into China-exclusive iPhones, cutting costs amid rising memory prices. ...

    Apple to Integrate YMTC NAND Flash, Exclusively for China Market
  • 2026 / 03 / 27

    Micron Considers Acquisition of JDI's Mobara Plant

    Micron is in talks to acquire JDI's Mobara LCD plant in Japan for conversion into a semiconductor assembly and testing facility....

    Micron Considers Acquisition of JDI's Mobara Plant
  • 2026 / 03 / 26

    Tower Semiconductor Strategically Restructures Japan Operations

    Tower Semiconductor restructures Japan operations: acquires full ownership of 300mm Fab 7 while Nuvoton takes 200mm Fab 5 for $25M...

    Tower Semiconductor Strategically Restructures Japan Operations
  • 2026 / 03 / 25

    Mastering the AMD/Xilinx Product Spectrum: CPLD/FPGA Comprehensive Guide

    A comprehensive guide to AMD/Xilinx FPGA evolution, spanning from classic CPLDs and early XC3000/4000 architectures through cost-optimized Spartan series to cutting-edge Zynq UltraScale+ MPSoCs......

    Mastering the AMD/Xilinx Product Spectrum: CPLD/FPGA Comprehensive Guide
  • 2026 / 03 / 24

    FCC Imposes Comprehensive Ban on Foreign-Manufactured Routers

    The FCC has banned all foreign-manufactured consumer routers from entering the U.S. market without authorization, citing national security risks....

    FCC Imposes Comprehensive Ban on Foreign-Manufactured Routers
  • 2026 / 03 / 23

    Qorvo RF Enterprise: Analysis of Its Popular GaN Amplifier Products

    Discover Qorvo's industry-leading RF solutions and GaN power amplifiers. From 5G infrastructure to satellite communications, explore best-selling ICs including QPA2966, TGA2214-CP, and QPA1314......

    Qorvo RF Enterprise: Analysis of Its Popular GaN Amplifier Products
  • 2026 / 03 / 20

    Three core components of power electronics: MOSFET, BJT, and IGBT

    A concise comparison of MOSFET, BJT, and IGBT— fundamental power semiconductor devices spanning voltage-controlled high-speed switching, current-controlled amplification, and hybrid high-voltage power solutions...

    Three core components of power electronics: MOSFET, BJT, and IGBT
  • 2026 / 03 / 19

    Middle East Conflict Triggers Risk of Surging Chip Material Costs

    Middle East conflict disrupts Qatar's helium supply, threatening semiconductor manufacturing costs. Chipmakers rely on helium for lithography, cooling, and leak detection—with no viable substitutes....

    Middle East Conflict Triggers Risk of Surging Chip Material Costs
  • 2026 / 03 / 18

    Break the Ice! NVIDIA Resumes H200 Production for China

    Nvidia resumes H200 chip production for China after securing U.S. export licenses. The restart follows December 2025 policy changes allowing sales with 25% revenue-sharing requirements....

    Break the Ice! NVIDIA Resumes H200 Production for China
Contact Information
close