LC4064V-75TN100C

Introducing the LC4064V-75TN100C, a versatile and powerful FPGA designed for a wide range of applications. This field-programmable gate array from Lattice Semiconductor is ideal for a variety of industries, including telecommunications, industrial automation, and automotive. With an impressive capacity of 4,000 programmable logic cells, the LC4064V-75TN100C provides ample space for implementing complex designs. The onboard memory resources, including 64K bits of embedded block RAM, offer high-speed data storage for efficient data processing. Furthermore, this FPGA features 75MHz maximum operating frequency, ensuring reliable and robust performance even in demanding applications. Its low power consumption makes it an energy-efficient solution, saving costs and reducing environmental impact. The LC4064V-75TN100C also excels in terms of connectivity with a wide range of I/O options, including digital inputs and outputs, clock inputs, and global signals. This flexibility allows for seamless integration with existing systems and easy adaptation to various project requirements. With its exceptional performance, solid connectivity options, and extensive memory resources, the LC4064V-75TN100C is an excellent choice for innovative and cutting-edge designs requiring complex and resource-intensive FPGA implementations.

banner

Other Products

View More
  • H-127-ND

    H-127-ND

  • CT3066-ND

    CT3066-ND

  • 716-ACCPOTRDB000685710-ND

    716-ACCPOTRDB000685710-ND

  • H-36-2-ND

    H-36-2-ND

  • 716-ACCRFCADRANCG1154T-ND

    716-ACCRFCADRANCG1154T-ND

  • 5310-ND

    5310-ND

  • 987-1691-ND

    987-1691-ND

  • 7072E-ND

    7072E-ND

  • H-37-1-ND

    H-37-1-ND

  • S710-ND

    S710-ND

  • 6532-ND

    6532-ND

  • H-118-2-ND

    H-118-2-ND

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close