MASWSS0162TR

Introducing the MASWSS0162TR, the ultimate solution for high-performance wireless communication systems. This power amplifier module is designed to enhance the efficiency and reliability of your wireless applications, making it a versatile choice for a wide range of industries. With its compact size and low power consumption, the MASWSS0162TR provides a seamless integration into your existing systems, making it ideal for space-constrained environments. This module operates within a frequency range of 2.3-2.7 GHz, ensuring compatibility with various wireless standards including Wi-Fi, WiMAX, and LTE. The MASWSS0162TR incorporates advanced GaAs MMIC technology, delivering exceptional performance with high output power and excellent linearity. Its integrated control interface enables easy configuration and efficient power control, while its optimized design minimizes distortion and ensures consistent signal quality. This power amplifier module offers superior reliability and robustness, with built-in protection features against over/under voltage, over temperature, and RF overdrive. Whether you're designing wireless routers, base stations, or other communication devices, the MASWSS0162TR is the perfect choice for maximizing system performance and improving overall user experience. Upgrade your wireless applications today with the MASWSS0162TR power amplifier module.

banner

Other Products

View More
  • LTM-0418M-J-ND

    LTM-0418M-J-ND

  • LTM-0402M-J-ND

    LTM-0402M-J-ND

  • LTS-4801E-NB-ND

    LTS-4801E-NB-ND

  • DC56-51SYKWA-ND

    DC56-51SYKWA-ND

  • 2661-CDSC23R1W-ND

    2661-CDSC23R1W-ND

  • DA56-11SYKWA-ND

    DA56-11SYKWA-ND

  • MSD399C-ND

    MSD399C-ND

  • MAN6161C-ND

    MAN6161C-ND

  • 2661-CDSC52B2WF-ND

    2661-CDSC52B2WF-ND

  • LDT-M2806RI-ND

    LDT-M2806RI-ND

  • LTC-2621B-ND

    LTC-2621B-ND

  • ADSP-H1G1-ND

    ADSP-H1G1-ND

Related Blogs

  • 2026 / 05 / 15

    Tower Semiconductor Secures $1.3 Billion Silicon Photonics Order

    Tower Semiconductor lands $1.3B silicon photonics deal for 2027, locking AI data center demand. Scaling CPO & optical interconnect capacity....

    Tower Semiconductor Secures $1.3 Billion Silicon Photonics Order
  • 2026 / 05 / 14

    New Products from ST: High-Precision Op Amp and Ultra-Low-Power Image Sensors

    ST launches TSB192 precision dual op-amp with 20µV offset and 8MHz bandwidth, alongside VD55G4/VD65G4 ultra-low-power global-shutter image sensors in the BrightSense family....

    New Products from ST: High-Precision Op Amp and Ultra-Low-Power Image Sensors
  • 2026 / 05 / 13

    Cmsemicon Advances Memory Portfolio: CMS25Q32A Mass Production Imminent

    Cmsemicon CMS25Q32A 32 Mbit SPI NOR Flash completes mass-production qualification, expanding its MCU-plus memory lineup for embedded, IoT and smart hardware....

    Cmsemicon Advances Memory Portfolio: CMS25Q32A Mass Production Imminent
  • 2026 / 05 / 12

    Analysis and Selection Guide for Popular Electronic Components in May

    Driven by AI, EVs, and automation, demand surges for core components like MCUs, memory, PMICs, and RF chips in May 2026. This guide analyzes popular parts for selection....

    Analysis and Selection Guide for Popular Electronic Components in May
  • 2026 / 05 / 11

    Selection Guide: In-Depth Analysis of Voltage Reference ICs

    Voltage Reference ICs deliver ultra-stable, precision voltage outputs essential for ADC/DAC accuracy. Key specs include initial accuracy, temperature coefficient, and low-frequency noise. ...

    Selection Guide: In-Depth Analysis of Voltage Reference ICs
  • 2026 / 05 / 09

    Google Tensor G7 Chip: Continues with 2nm Process

    Google's upcoming Tensor G7 chip, manufactured by TSMC on a 2nm process, is set to power the Pixel 12 series. It continues Google's AI-first design philosophy......

    Google Tensor G7 Chip: Continues with 2nm Process
  • 2026 / 05 / 08

    Industry Restructuring: ICE Automakers Divest Non-Core Manufacturing Assets

    Global ICE automakers are divesting non-core manufacturing assets, while Chinese EV makers capitalize by acquiring idle overseas capacity to accelerate expansion....

    Industry Restructuring: ICE Automakers Divest Non-Core Manufacturing Assets
  • 2026 / 05 / 07

    Samsung Completely Exits the Chinese Home Appliance Market

    Samsung exits China's home appliance market effective May 6, 2026, halting sales of TVs, refrigerators, and more, while keeping its smartphone business. ...

    Samsung Completely Exits the Chinese Home Appliance Market
  • 2026 / 05 / 04

    Modern Electronics Core: A Guide to CMOS Logic Gate ICs

    CMOS logic gate ICs form the foundation of digital circuits. They use complementary MOSFET pairs for near-zero static power, high noise immunity, and versatile voltage operation....

    Modern Electronics Core: A Guide to CMOS Logic Gate ICs
  • 2026 / 04 / 30

    Amazon Rises to Top Three in Global Data Center Chip Market

    Amazon has become a top-three data center chip designer, with its in-house semiconductor business now generating over $20B annually....

    Amazon Rises to Top Three in Global Data Center Chip Market
Contact Information
close