MDD7N20CRH

Introducing the high-performance MDD7N20CRH - a cutting-edge product that revolutionizes the electronics market. The MDD7N20CRH is a power MOSFET transistor designed to provide exceptional efficiency and reliability in a compact form factor. Engineered to withstand high levels of stress and heat, this transistor delivers superior performance in extreme conditions. With a maximum drain current rating of 7A and a low on-resistance of 0.2 ohms, the MDD7N20CRH offers unmatched power handling capabilities, making it perfect for applications that require high power density and optimal performance. This power MOSFET transistor also features advanced thermal management, ensuring efficient heat dissipation and enhancing its overall longevity. Its low-profile and compact package design make it easy to integrate into a wide range of space-constrained electronic devices and systems. Whether you're working on industrial equipment, automotive systems, or consumer electronics, the MDD7N20CRH is the ideal solution to enhance your product's performance and reliability. Its exceptional power handling capabilities and robust construction make it a reliable choice for the most demanding applications. Experience the power of the MDD7N20CRH - the future of power MOSFET transistors.

banner

Other Products

View More
  • 595D335X0020B2T-ND

    595D335X0020B2T-ND

  • 478-TBJD336M035LRSZ0700TR-ND

    478-TBJD336M035LRSZ0700TR-ND

  • 478-TBME477M006LGSC0845TR-ND

    478-TBME477M006LGSC0845TR-ND

  • 299D225X9025AB6E3-ND

    299D225X9025AB6E3-ND

  • 478-TBJE227K010CRSB0024TR-ND

    478-TBJE227K010CRSB0024TR-ND

  • 478-CWR11MC475KBA-ND

    478-CWR11MC475KBA-ND

  • 150D475X9075R2BE3-ND

    150D475X9075R2BE3-ND

  • 299D335X0016AB1-ND

    299D335X0016AB1-ND

  • 718-1448-2-ND,718-1448-1-ND

    718-1448-2-ND,718-1448-1-ND

  • 478-CWR11DB226KMB-ND

    478-CWR11DB226KMB-ND

  • 150D224X0075A2T-ND

    150D224X0075A2T-ND

  • 399-4764-2-ND,399-4764-1-ND,399-4764-6-ND

    399-4764-2-ND,399-4764-1-ND,399-4764-6-ND

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close