MTB55N03KS6

Introducing the MTB55N03KS6, a game-changing power MOSFET designed to enhance the performance and efficiency of your electronic devices. With its low on-resistance and exceptional thermal resistance, this MOSFET is perfect for applications that demand high power handling capabilities. Built using the latest technology, the MTB55N03KS6 delivers outstanding power density, allowing for reduced size and weight in a wide range of applications. Whether you're designing a power supply unit, motor control system, or switching regulator, this MOSFET provides excellent performance and reliability. Featuring a maximum drain current of 55A and a low gate charge, the MTB55N03KS6 ensures efficient power delivery and low power losses. Its robust design ensures superior performance even in the harshest environments, making it an ideal choice for industrial applications. Designed for ease of use, the MTB55N03KS6 is available in a compact TO-263 package that allows for easy integration into your design. Trust the MTB55N03KS6 to deliver exceptional performance and reliability in your next project.

banner

Other Products

View More
  • Toshiba Semiconductor and Storage 7UL1T125FU,LF

    Toshiba Semiconductor and Storage 7UL1T125FU,LF

  • Quality Semiconductor QS74FCT16652CTPA

    Quality Semiconductor QS74FCT16652CTPA

  • Quality Semiconductor QS74FCT828BTSO

    Quality Semiconductor QS74FCT828BTSO

  • onsemi MC74VHC1G07MU1TCG

    onsemi MC74VHC1G07MU1TCG

  • Nexperia USA Inc. 74AHCV17APWJ

    Nexperia USA Inc. 74AHCV17APWJ

  • Quality Semiconductor QS3L383SO

    Quality Semiconductor QS3L383SO

  • onsemi MC74ACT534DW

    onsemi MC74ACT534DW

  • Texas Instruments SN74LVC245ANS

    Texas Instruments SN74LVC245ANS

  • Nexperia USA Inc. 74LVC541APW,112

    Nexperia USA Inc. 74LVC541APW,112

  • Texas Instruments SN74ABT827NTG4

    Texas Instruments SN74ABT827NTG4

  • NXP USA Inc. 74ALVCH16244DGG11

    NXP USA Inc. 74ALVCH16244DGG11

  • onsemi NLU3G16FMUTCG

    onsemi NLU3G16FMUTCG

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close