MTN3N60CI3**

Introducing the MTN3N60CI3**, a revolutionary product that brings unmatched performance and reliability to various electronic applications. Designed with utmost precision and advanced technology, this product is engineered to meet the ever-growing demands of industries that require efficient power management. The MTN3N60CI3** is a cutting-edge power MOSFET that boasts a low on-resistance of just 3.6 ohms, enabling seamless power delivery and minimizing energy losses. Its superior thermal performance ensures optimum efficiency even in high-temperature environments, making it suitable for a wide range of applications. With a voltage rating of 600V and a current rating of 3A, this product is ideal for power supplies, motor control systems, and other electronic devices that demand exceptional power handling capabilities. Its robust construction guarantees long-lasting performance, enhancing the overall reliability of any system. Furthermore, the MTN3N60CI3** features industry-leading gate charge characteristics, enabling fast and efficient switching operations. This not only enhances system efficiency but also reduces electromagnetic interference, ensuring clean and stable power delivery. Trust the MTN3N60CI3** to provide unparalleled performance and reliability for all your power management needs. Upgrade your systems today and experience the difference with this exceptional product.

banner

Other Products

View More
  • Beacon EmbeddedWorks CENGLH7A404-11-430EI

    Beacon EmbeddedWorks CENGLH7A404-11-430EI

  • Critical Link LLC 3359-EX-227-RC-X

    Critical Link LLC 3359-EX-227-RC-X

  • Critical Link LLC L138-FI-236-RL

    Critical Link LLC L138-FI-236-RL

  • NXP USA Inc. M5475CFE

    NXP USA Inc. M5475CFE

  • Beacon EmbeddedWorks CENGLH7A404-11-550HC

    Beacon EmbeddedWorks CENGLH7A404-11-550HC

  • Trenz Electronic GmbH TE0841-01-035-1I

    Trenz Electronic GmbH TE0841-01-035-1I

  • NXP USA Inc. MOD5270BXX

    NXP USA Inc. MOD5270BXX

  • Digi DC-ME-Y413-C-B

    Digi DC-ME-Y413-C-B

  • Beacon EmbeddedWorks CENGPXA270-312-10-550ECR

    Beacon EmbeddedWorks CENGPXA270-312-10-550ECR

  • Digi 20-101-1055

    Digi 20-101-1055

  • Beacon EmbeddedWorks CENGLH7A404-11-503HCR

    Beacon EmbeddedWorks CENGLH7A404-11-503HCR

  • Trenz Electronic GmbH TE0720-03-S002

    Trenz Electronic GmbH TE0720-03-S002

Related Blogs

  • 2026 / 05 / 15

    Tower Semiconductor Secures $1.3 Billion Silicon Photonics Order

    Tower Semiconductor lands $1.3B silicon photonics deal for 2027, locking AI data center demand. Scaling CPO & optical interconnect capacity....

    Tower Semiconductor Secures $1.3 Billion Silicon Photonics Order
  • 2026 / 05 / 14

    New Products from ST: High-Precision Op Amp and Ultra-Low-Power Image Sensors

    ST launches TSB192 precision dual op-amp with 20µV offset and 8MHz bandwidth, alongside VD55G4/VD65G4 ultra-low-power global-shutter image sensors in the BrightSense family....

    New Products from ST: High-Precision Op Amp and Ultra-Low-Power Image Sensors
  • 2026 / 05 / 13

    Cmsemicon Advances Memory Portfolio: CMS25Q32A Mass Production Imminent

    Cmsemicon CMS25Q32A 32 Mbit SPI NOR Flash completes mass-production qualification, expanding its MCU-plus memory lineup for embedded, IoT and smart hardware....

    Cmsemicon Advances Memory Portfolio: CMS25Q32A Mass Production Imminent
  • 2026 / 05 / 12

    Analysis and Selection Guide for Popular Electronic Components in May

    Driven by AI, EVs, and automation, demand surges for core components like MCUs, memory, PMICs, and RF chips in May 2026. This guide analyzes popular parts for selection....

    Analysis and Selection Guide for Popular Electronic Components in May
  • 2026 / 05 / 11

    Selection Guide: In-Depth Analysis of Voltage Reference ICs

    Voltage Reference ICs deliver ultra-stable, precision voltage outputs essential for ADC/DAC accuracy. Key specs include initial accuracy, temperature coefficient, and low-frequency noise. ...

    Selection Guide: In-Depth Analysis of Voltage Reference ICs
  • 2026 / 05 / 09

    Google Tensor G7 Chip: Continues with 2nm Process

    Google's upcoming Tensor G7 chip, manufactured by TSMC on a 2nm process, is set to power the Pixel 12 series. It continues Google's AI-first design philosophy......

    Google Tensor G7 Chip: Continues with 2nm Process
  • 2026 / 05 / 08

    Industry Restructuring: ICE Automakers Divest Non-Core Manufacturing Assets

    Global ICE automakers are divesting non-core manufacturing assets, while Chinese EV makers capitalize by acquiring idle overseas capacity to accelerate expansion....

    Industry Restructuring: ICE Automakers Divest Non-Core Manufacturing Assets
  • 2026 / 05 / 07

    Samsung Completely Exits the Chinese Home Appliance Market

    Samsung exits China's home appliance market effective May 6, 2026, halting sales of TVs, refrigerators, and more, while keeping its smartphone business. ...

    Samsung Completely Exits the Chinese Home Appliance Market
  • 2026 / 05 / 04

    Modern Electronics Core: A Guide to CMOS Logic Gate ICs

    CMOS logic gate ICs form the foundation of digital circuits. They use complementary MOSFET pairs for near-zero static power, high noise immunity, and versatile voltage operation....

    Modern Electronics Core: A Guide to CMOS Logic Gate ICs
  • 2026 / 04 / 30

    Amazon Rises to Top Three in Global Data Center Chip Market

    Amazon has become a top-three data center chip designer, with its in-house semiconductor business now generating over $20B annually....

    Amazon Rises to Top Three in Global Data Center Chip Market
Contact Information
close