XC4VFX60-11FF672I

XC4VFX60-11FF672I


  • Manufacturer: AMD
  • CONEVO NO: XC4VFX60-11FF672I
  • Package: 672-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Series Virtex®-4 FX
Moisture Sensitivity Level (MSL) 4 (72 Hours)
RoHS Status RoHS non-compliant
Package / Case 672-BBGA, FCBGA
Mfr AMD
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Supplier Device Package 672-FCBGA (27x27)
Number of I/O 352
Voltage - Supply 1.14V ~ 1.26V
Number of Logic Elements/Cells 56880
Number of LABs/CLBs 6320
Total RAM Bits 4276224
Package Tray
Product Status Active
Conevo-Key Programmable Not Verified
Base Product Number XC4VFX60
REACH Status REACH Unaffected
Standard Package 1
ECCN 3A991D
HTSUS 8542.39.0001

XC4VFX60-11FF672I Virtex-4 FX FPGA

The XC4VFX60-11FF672I is a high-performance Virtex-4 FX series field-programmable gate array (FPGA) from Xilinx (now part of AMD), engineered for high-bandwidth, high-processing-density digital signal processing (DSP) and connectivity applications. Housed in a 672-pin Fine-Pitch Ball Grid Array (FFBGA) package, this FPGA is built on a 90nm CMOS process and features a hybrid architecture integrating 60,192 logic cells, 3,600 Kbits of block RAM, 240 18x18 multiplier blocks (optimized for DSP algorithms), and 4 integrated PowerPC® 405 RISC processors for hardwired embedded processing.

Key features include 24 high-speed serial transceivers (supporting 1.0625 Gbps to 3.125 Gbps for protocols like Gigabit Ethernet, Serial RapidIO, and PCI Express®), 8 global clock networks with advanced clock management tiles, support for DDR2/DDR3 SDRAM interfaces, and operation across the industrial temperature range (-40°C to +100°C). It also offers low-power configuration options, partial reconfiguration capability for dynamic system updates, and compliance with RoHS standards, making it a versatile solution for high-performance embedded systems.

Selection Guide & Alternative FPGA Models

When selecting FPGA ic, prioritize matching its logic cell count, DSP multiplier density, and high-speed serial transceiver requirements to your system's processing and connectivity needs. And then, consider package type for PCB layout and thermal management, and verify temperature range compatibility for harsh environment deployments. For applications requiring alternative solutions from leading semiconductor manufacturers, the following models are recommended:

● EP4SE660F45I4 (Intel/Altera): A Stratix IV E series FPGA with 660,160 logic elements, 1,536 DSP blocks, and 48 high-speed transceivers, optimized for high-bandwidth telecommunications and industrial processing applications.

● Kintex-7 XC7K325T-2FFG900I (AMD/Xilinx): A mid-range Kintex-7 FPGA with 326,080 logic cells, 2,040 DSP slices, and 28 GTX transceivers, a cost-effective upgrade for designs needing enhanced performance over Virtex-4 FX series.

● AGILEX 7 FPGA (Intel/Altera): A next-gen FPGA with 10nm process technology, integrated AI tensor blocks, and up to 112 112Gbps transceivers, suited for cutting-edge 5G, AI, and high-performance computing applications.

● Zynq-7045 XC7Z045-2FFG900I (AMD/Xilinx): A Zynq-7000 All Programmable SoC combining a dual-core ARM Cortex-A9 processor with 530,816 logic cells and 40 DSP slices, ideal for embedded systems needing both processing and FPGA flexibility.

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