| Parameters | |
|---|---|
| Series | Virtex®-4 FX |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| RoHS Status | RoHS non-compliant |
| Package / Case | 672-BBGA, FCBGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 672-FCBGA (27x27) |
| Number of I/O | 352 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Number of Logic Elements/Cells | 56880 |
| Number of LABs/CLBs | 6320 |
| Total RAM Bits | 4276224 |
| Package | Tray |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | XC4VFX60 |
| REACH Status | REACH Unaffected |
| Standard Package | 1 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
XC4VFX60-11FF672I Virtex-4 FX FPGA
The XC4VFX60-11FF672I is a high-performance Virtex-4 FX series field-programmable gate array (FPGA) from Xilinx (now part of AMD), engineered for high-bandwidth, high-processing-density digital signal processing (DSP) and connectivity applications. Housed in a 672-pin Fine-Pitch Ball Grid Array (FFBGA) package, this FPGA is built on a 90nm CMOS process and features a hybrid architecture integrating 60,192 logic cells, 3,600 Kbits of block RAM, 240 18x18 multiplier blocks (optimized for DSP algorithms), and 4 integrated PowerPC® 405 RISC processors for hardwired embedded processing.
Key features include 24 high-speed serial transceivers (supporting 1.0625 Gbps to 3.125 Gbps for protocols like Gigabit Ethernet, Serial RapidIO, and PCI Express®), 8 global clock networks with advanced clock management tiles, support for DDR2/DDR3 SDRAM interfaces, and operation across the industrial temperature range (-40°C to +100°C). It also offers low-power configuration options, partial reconfiguration capability for dynamic system updates, and compliance with RoHS standards, making it a versatile solution for high-performance embedded systems.
Selection Guide & Alternative FPGA Models
When selecting FPGA ic, prioritize matching its logic cell count, DSP multiplier density, and high-speed serial transceiver requirements to your system's processing and connectivity needs. And then, consider package type for PCB layout and thermal management, and verify temperature range compatibility for harsh environment deployments. For applications requiring alternative solutions from leading semiconductor manufacturers, the following models are recommended:
● EP4SE660F45I4 (Intel/Altera): A Stratix IV E series FPGA with 660,160 logic elements, 1,536 DSP blocks, and 48 high-speed transceivers, optimized for high-bandwidth telecommunications and industrial processing applications.
● Kintex-7 XC7K325T-2FFG900I (AMD/Xilinx): A mid-range Kintex-7 FPGA with 326,080 logic cells, 2,040 DSP slices, and 28 GTX transceivers, a cost-effective upgrade for designs needing enhanced performance over Virtex-4 FX series.
● AGILEX 7 FPGA (Intel/Altera): A next-gen FPGA with 10nm process technology, integrated AI tensor blocks, and up to 112 112Gbps transceivers, suited for cutting-edge 5G, AI, and high-performance computing applications.
● Zynq-7045 XC7Z045-2FFG900I (AMD/Xilinx): A Zynq-7000 All Programmable SoC combining a dual-core ARM Cortex-A9 processor with 530,816 logic cells and 40 DSP slices, ideal for embedded systems needing both processing and FPGA flexibility.