Parameters | |
---|---|
Series | Kintex®-7 |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
RoHS Status | ROHS3 Compliant |
Package / Case | 900-BBGA, FCBGA |
Mfr | AMD |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Supplier Device Package | 900-FCBGA (31x31) |
Number of I/O | 500 |
Voltage - Supply | 0.97V ~ 1.03V |
Number of Logic Elements/Cells | 326080 |
Number of LABs/CLBs | 25475 |
Total RAM Bits | 16404480 |
Package | Tray |
Product Status | Active |
Conevo-Key Programmable | Not Verified |
Base Product Number | XC7K325 |
REACH Status | REACH Unaffected |
Standard Package | 1 |
ECCN | 3A991D |
HTSUS | 8542.39.0001 |
XC7K325T-2FFG900I Kintex-7 FPGA IC
The XC7K325T-2FFG900I from Xilinx (now AMD) is a high-performance member of the Kintex-7 family of field-programmable gate arrays (FPGAs), designed to deliver an optimal balance of performance, power efficiency, and cost for a wide range of advanced applications. This device features a 28nm high-k metal gate (HKMG) process technology that provides exceptional logic capacity and DSP performance while maintaining low power consumption. With 326,080 logic cells, 840 DSP slices, and 16,020 Kb of block RAM, it offers substantial resources for complex digital signal processing, high-speed connectivity, and embedded system development. The FPGA supports numerous high-speed serial transceivers, making it ideal for applications requiring robust data processing and interface capabilities in telecommunications, industrial automation, and aerospace systems.
Key Features and Application
The XC7K325T-2FFG900I delivers outstanding electrical performance with a core voltage of 1.0V and support for multiple I/O banks operating at voltages from 1.2V to 3.3V. It features 16 high-speed serial transceivers capable of operating at up to 12.5 Gbps each, providing ample bandwidth for protocols such as PCIe Gen3, SATA, and 10Gb Ethernet. The device includes 840 DSP slices with 25 x 18 multipliers for high-precision arithmetic operations, and 16,020 Kb of block RAM with built-in error correction code (ECC). Operating at a grade 2 industrial temperature range of -40°C to +100°C, it ensures reliability in harsh environments while maintaining a typical power consumption of 3W to 5W depending on configuration and utilization.
The XC7K325T-2FFG900I is widely used in applications demanding high processing power and flexibility, including wired and wireless communication infrastructure such as 4G/5G basebands, network routers, and switches. It is also ideal for industrial automation systems, medical imaging equipment, aerospace and defense electronics, and high-performance computing applications. The FPGA's robust DSP capabilities make it suitable for radar signal processing, software-defined radio (SDR), and video processing systems, while its high-speed transceivers support data acquisition and real-time processing in scientific instruments and test and measurement equipment.
Alternative Field Programmable Gate Array Models
● XC7K410T-2FFG900I: A higher-capacity Kintex-7 FPGA with 410,000 logic cells and increased DSP and memory resources for more complex designs.
● XC7V585T-1FFG1157I: A Virtex-7 series FPGA offering higher performance and greater transceiver bandwidth for ultra-high-end applications.
● Arria 10 GX400: Intel's mid-range FPGA with similar logic capacity and transceiver performance, targeting comparable applications.
● Artix-7 200T: A lower-cost, lower-power FPGA from Xilinx for applications requiring fewer resources and reduced power consumption.