| Parameters | |
|---|---|
| Series | - |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS non-compliant |
| Package / Case | 48-TFBGA, CSPBGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Supplier Device Package | 48-CSP (8x9) |
| Memory Size | 16Mb |
| Voltage - Supply | 1.65V ~ 2V |
| Programmable Type | In System Programmable |
| Package | Tray |
| Product Status | Obsolete |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | XCF16 |
| REACH Status | REACH Unaffected |
| Standard Package | 1 |
| ECCN | 3A991B1B1 |
| HTSUS | 8542.32.0071 |
XCF16PFS48C Flash PROM Chip
The XCF16PFS48C is a Platform Flash In-System Programmable Configuration PROM designed by Xilinx (now part of AMD), specifically engineered for FPGA configuration and non-volatile storage. Featuring a 16-megabit (16,777,216-bit) memory density, this EEPROM-based chip operates at a nominal voltage of 1.8V (compatible with 1.5V to 3.3V I/O levels) and supports industrial-grade temperature ranges (-40°C to +85°C). Packaged in a compact 48-pin TFBGA (Thin Fine-Pitch Ball Grid Array) with a 0.8mm pitch, it enables high-density storage in space-constrained designs. The device is widely used in industrial automation, communication systems, and embedded applications requiring reliable, reconfigurable firmware storage. Its JTAG interface allows for in-system programming, design revisioning, and cascading multiple devices for storing longer bitstreams.
Alternative storage chip solutions
● XCF08PFSG48C (Xilinx/AMD): An 8-megabit variant of the Platform Flash series, offering similar voltage compatibility and JTAG programming but with half the storage capacity, ideal for cost-sensitive applications.
● XCF32PFG48 (Xilinx/AMD): A 32-megabit upgrade to the XCF16PFS48C, doubling storage capacity while maintaining identical pin count and voltage specifications, suited for complex FPGA configurations.
● MX25L1606E (Macronix): A 16-megabit SPI NOR Flash memory chip with a 48-pin TFBGA package, providing a cost-effective alternative for non-FPGA applications requiring high-speed read/write operations.
● S25FL164K (Cypress/Infineon): A 16-megabit SPI Flash memory device with industrial-grade temperature support (-40°C to +105°C), offering higher endurance (100,000 cycles) for data-intensive storage needs.