AMD XCR3512XL-10FT256I
| Parameters | |
|---|---|
| Number of I/O | 212 |
| Number of Gates | 12000 |
| Programmable Type | In System Programmable (min 1K program/erase cycles) |
| Voltage Supply - Internal | 2.7V ~ 3.6V |
| Number of Logic Elements/Blocks | 32 |
| Delay Time tpd(1) Max | 9 ns |
| Number of Macrocells | 512 |
| Package | Bulk |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| Base Product Number | XCR3512 |
| REACH Status | REACH Unaffected |
| Standard Package | 90 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
| Series | CoolRunner XPLA3 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS non-compliant |
| Package / Case | 256-LBGA |
| Mfr | AMD |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Supplier Device Package | 256-FTBGA (17x17) |
Xilinx CoolRunner FPGA XCR3512XL-10FT256I
The XCR3512XL-10FT256I is a high-performance, field-programmable gate array (FPGA) from Xilinx's CoolRunner XPLA3 family, designed for low-power and high-speed applications. This chip features 512 macrocells, offering flexible logic integration for complex digital designs. It operates at a speed grade of 10ns, ensuring rapid signal processing and efficient performance in embedded systems, telecommunications, and industrial automation. The device is housed in a 256-pin FineLine BGA (FT256) package, providing robust thermal and electrical characteristics for reliable operation in demanding environments.
Equipped with advanced in-system programmability (ISP), the XCR3512XL-10FT256I supports seamless reconfiguration, making it ideal for prototyping and iterative development. Its low-power CMOS technology ensures minimal energy consumption, catering to battery-operated and energy-sensitive applications. The FPGA includes embedded block RAM, high-speed I/O interfaces, and clock management resources, enabling designers to implement sophisticated digital circuits with ease.
The XCR3512XL-10FT256I is widely used in networking equipment, automotive electronics, and consumer electronics due to its reliability and versatility. It supports a wide operating temperature range and complies with industry standards for electromagnetic compatibility (EMC) and signal integrity. Development tools such as Xilinx ISE and Vivado provide comprehensive support for design, simulation, and debugging, streamlining the development process.
Alternative Models:
● XCR3128XL-10VQ100I: 128 macrocells, 10ns speed, 100-pin VQFP, low-power operation.
● XCR3256XL-10FT256I: 256 macrocells, 10ns speed, 256-pin BGA, enhanced I/O capabilities.
● XCR3384XL-10PQ208I: 384 macrocells, 10ns speed, 208-pin QFP, optimized for high-density designs.
● XCR3512XL-12FT256I: 512 macrocells, 12ns speed, 256-pin BGA, slightly lower speed grade for cost-sensitive applications.
