Intel 10M16SAU169I7G
| Parameters | |
|---|---|
| Series | MAX® 10 |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | RoHS Compliant |
| Package / Case | 169-LFBGA |
| Mfr | Intel |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 169-UBGA (11x11) |
| Number of I/O | 130 |
| Voltage - Supply | 2.85V ~ 3.465V |
| Number of Logic Elements/Cells | 16000 |
| Number of LABs/CLBs | 1000 |
| Total RAM Bits | 562176 |
| Package | Tray |
| Product Status | Active |
| Conevo-Key Programmable | Not Verified |
| REACH Status | REACH Unaffected |
| Standard Package | 176 |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
10M16SAU169I7G Intel MAX 10 FPGA IC 130 562176 16000 169-LFBGA
The 10M16SAU169I7G is a mid-range MAX® 10 FPGA from Intel (formerly Altera), designed for cost-sensitive yet performance-driven embedded applications. Built on a non-volatile, flash-based architecture, this device integrates 16,000 logic elements (LEs), 504 Kbits of embedded memory (M9K blocks), and 56 18x18 multipliers, making it ideal for industrial control, automotive systems, and IoT edge computing. Operating at industrial temperature ranges (-40°C to +100°C) and supporting dual-configuration flash, the 10M16SAU169I7G offers instant-on capability, low power consumption, and high reliability without requiring external configuration memory. Its hardened DSP blocks and Nios® II soft-core processor support enable flexible digital signal processing and embedded system integration.
Key Features and Applications
The 10M16SAU169I7G stands out with its single-chip solution, eliminating the need for an external configuration device, reducing BOM cost and board space. It features 1.2V core voltage with 3.3V/2.5V/1.8V I/O flexibility, supporting mixed-voltage designs. The FPGA includes hardened PCIe Gen1 x1 and Gigabit Ethernet MAC blocks, enhancing connectivity for networking applications. Its low static power (<100 µW) and fast startup (<3 ms) make it suitable for battery-powered and safety-critical systems. Additionally, it supports AES-256 bitstream encryption, ensuring secure firmware updates and IP protection. The device also integrates analog features (ADC, PLLs) for sensor interfacing and clock management.
This FPGA is widely used in motor control, industrial automation, and human-machine interfaces (HMI) due to its deterministic response and real-time processing. In automotive electronics, it enables ADAS sensor fusion, infotainment systems, and battery management. Its low-power design suits IoT gateways, wearable devices, and smart sensors. The 10M16SAU169I7G is also deployed in consumer electronics (4K video processing, drones) and medical devices (portable diagnostics, imaging). Its radiation-hardened variants are applicable in aerospace systems.
Alternative DSP FPGA Models
● 10M08SAU169I7G: Lower density (8K LEs), cost-optimized for simple control logic.
● 10M25SAU169I7G: Higher capacity (25K LEs), suited for complex DSP tasks.
● Cyclone® IV EP4CE10F17C8N: Comparable logic density, lower power, but volatile (needs external flash).
● Lattice MachXO3LF-4300UWG: Competing flash-based FPGA with similar I/O count.
● Artix®-7 XC7A25T-1CSG325I: Higher performance (28nm), but requires external configuration.
