Microchip Technology DSPIC33FJ09GS302T-E/MX

DSPIC33FJ09GS302T-E/MX


  • Manufacturer: Microchip Technology
  • CONEVO NO: DSPIC33FJ09GS302T-E/MX
  • Package: 28-UQFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
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Parameters
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 3,300
Mfr Microchip Technology
Series Automotive, AEC-Q100, dsPIC™ 33F
Package Tape & Reel (TR)
Product Status Active
Core Processor dsPIC
Core Size 16-Bit
Speed 40 MIPs
Connectivity I²C, IrDA, LINbus, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O 21
Program Memory Size 9KB (3K x 24)
Program Memory Type FLASH
EEPROM Size -
RAM Size 1K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Data Converters A/D 8x10b; D/A 2x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 28-UQFN Exposed Pad
Supplier Device Package 28-UQFN (6x6)
Base Product Number DSPIC33FJ09GS302
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
dsPIC Automotive, AEC-Q100, dsPIC™ 33F Microcontroller IC 16-Bit 40 MIPs 9KB (3K x 24) FLASH 28-UQFN (6x6)
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