NXP USA Inc. KMC68MH360ZP25VL

KMC68MH360ZP25VL


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: KMC68MH360ZP25VL
  • Package: 357-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: KMC68MH360ZP25VL(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series M683xx
Package Tray
Product Status Obsolete
Core Processor CPU32+
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 25MHz
Co-Processors/DSP Communications; CPM
RAM Controllers DRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10Mbps (1)
SATA -
USB -
Voltage - I/O 3.3V
Operating Temperature 0°C ~ 70°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 357-BGA
Supplier Device Package 357-PBGA (25x25)
Additional Interfaces SCC, SMC, SPI
Base Product Number KMC68
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 2
CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 357-PBGA (25x25)
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