NXP USA Inc. LPC3180FEL320/01,5

LPC3180FEL320/01,5


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: LPC3180FEL320/01,5
  • Package: 320-LFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: LPC3180FEL320/01,5(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC3100
Package Tray
Product Status Obsolete
Core Processor ARM9®
Core Size 16/32-Bit
Speed 208MHz
Connectivity EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG
Peripherals DMA, PWM, WDT
Number of I/O 55
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 1.1V ~ 3.3V
Data Converters A/D 3x10b
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 320-LFBGA
Supplier Device Package 320-LFBGA (13x13)
Base Product Number LPC3180
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 160
ARM9® LPC3100 Microcontroller IC 16/32-Bit 208MHz ROMless 320-LFBGA (13x13)
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