NXP USA Inc. MC10XS3412CHFKR2

MC10XS3412CHFKR2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC10XS3412CHFKR2
  • Package: 24-PowerQFN
  • Datasheet: -
  • Stock: In stock
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Details

Tags

Parameters
Series -
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status ROHS3 Compliant
Package / Case 24-PowerQFN
Interface SPI
Mfr NXP USA Inc.
Mounting Type Surface Mount
Operating Temperature -40°C ~ 150°C (TJ)
Input Type -
Output Type N-Channel
Number of Outputs 4
Switch Type General Purpose
Supplier Device Package 24-PQFN (12x12)
Output Configuration High Side
Fault Protection Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Voltage - Load 6V ~ 20V
Rds On (Typ) 10mOhm, 12mOhm
Current - Output (Max) -
Ratio - Input:Output 1:1
Features Internal PWM, Slew Rate Controlled, Watchdog Timer
Package Tape & Reel (TR)
Product Status Obsolete
Base Product Number MC10XS3412
REACH Status REACH Unaffected
Other Names 934070637528
Standard Package 1,200
ECCN EAR99
HTSUS 8542.39.0001

MC10XS3412CHFKR2 Power Switch/Driver Chip Overview

The MC10XS3412CHFKR2, developed by NXP USA Inc., is a high-side power switch designed for automotive and industrial applications. This 32-pin device operates within a voltage range of 4.5V to 28V and supports a continuous load current of up to 1.2A. It features an integrated MOSFET with ultra-low on-resistance (RDS(on)) of 50mΩ, ensuring efficient power management. The chip is housed in a compact, surface-mount HFKW package, optimized for harsh environments with an extended temperature range of -40°C to +125°C. Compliant with AEC-Q100 standards, it incorporates advanced diagnostics and protection mechanisms, making it ideal for safety-critical systems.

MC10XS3412CHFKR2 Key Features

The MC10XS3412CHFKR2 offers multiple robust features, including overcurrent protection, overtemperature shutdown, and reverse battery protection. It supports PWM (Pulse Width Modulation) for precise load control and includes a diagnostic feedback pin for real-time fault reporting, such as short-to-ground or open-load detection. The device also provides adjustable current limiting and low quiescent current in standby mode (<10µA), enhancing energy efficiency. Its SPI (Serial Peripheral Interface) enables configurability and communication with microcontrollers, while the integrated charge pump ensures reliable operation under low-voltage conditions.

MC10XS3412CHFKR2 Applications

This chip is widely used in automotive electronic systems, including body control modules (BCMs), lighting systems (e.g., LED headlights, interior lighting), and motor drivers for seat adjustment or window controls. It is also employed in industrial automation for solenoid actuation, power distribution units, and battery management systems. Additional applications include HVAC controls, fuel pump drivers, and smart junction boxes, leveraging its diagnostic capabilities and rugged design for mission-critical environments.

Alternative Models

1. MC10XS3425CHFKR2: A higher-current variant from NXP, supporting up to 2.5A with similar diagnostic features and package compatibility.

2. STMicroelectronics VND7140AJTR: A dual-channel high-side driver offering 140mΩ RDS(on) and SPI interface, suitable for parallel load applications.

3. Infineon BTS50015-1TMC: A 1.5A high-side switch with PROFET™ technology, emphasizing enhanced thermal performance and fault reporting.

4. TI TPS2HB16AQPWPRQ1: A 16A automotive-grade switch with integrated current sensing, ideal for higher-power systems requiring precision monitoring.

5. ON Semiconductor NCV84160DDR2G: A cost-effective alternative with 1.5A capacity and basic diagnostics, targeting non-SPI-dependent designs.

Each alternative balances specific performance metrics, such as current handling, interface options, or cost, ensuring flexibility for diverse design requirements.

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