NXP USA Inc. MC33662BSEFR2

MC33662BSEFR2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC33662BSEFR2
  • Package: 8-SOIC (0.154", 3.90mm Width)
  • Datasheet: PDF
  • Stock: In stock
If you have any question, please feel free to contact with us.We will reply you within 24 hours.

Details

Tags

Parameters
HTSUS 8542.39.0001
Standard Package 2,500
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Active
Type Transceiver
Protocol LINbus
Number of Drivers/Receivers 1/1
Duplex -
Data Rate 20kbps
Voltage - Supply 7V ~ 18V
Operating Temperature -40°C ~ 125°C
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-SOIC
Base Product Number MC33662
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
1/1 Transceiver LINbus 8-SOIC
Contact Information
close