NXP USA Inc. MC9S08QG8CDNE

MC9S08QG8CDNE


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MC9S08QG8CDNE
  • Package: 8-SOIC (0.154", 3.90mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: MC9S08QG8CDNE(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series S08
Package Tube
Product Status Active
Core Processor S08
Core Size 8-Bit
Speed 20MHz
Connectivity I²C, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Number of I/O 4
Program Memory Size 8KB (8K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 512 x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
Data Converters A/D 4x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package 8-SOIC
Base Product Number MC9S08
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Other Names 935309459574
Standard Package 98
S08 S08 Microcontroller IC 8-Bit 20MHz 8KB (8K x 8) FLASH 8-SOIC
Contact Information
close