NXP USA Inc. MCF5275LCVM166

MCF5275LCVM166


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCF5275LCVM166
  • Package: 196-LBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MCF5275LCVM166(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MCF527x
Package Tray
Product Status Not For New Designs
Core Processor Coldfire V2
Core Size 32-Bit Single-Core
Speed 166MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals DMA, WDT
Number of I/O 61
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 1.4V ~ 1.6V
Data Converters -
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 196-LBGA
Supplier Device Package 196-LBGA (15x15)
Base Product Number MCF5275
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1 FRE
HTSUS 8542.31.0001
Other Names 935325234557
Standard Package 630
Coldfire V2 MCF527x Microcontroller IC 32-Bit Single-Core 166MHz ROMless 196-LBGA (15x15)
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