NXP USA Inc. MCF5372LCVM240

MCF5372LCVM240


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MCF5372LCVM240
  • Package: 196-LBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MCF5372LCVM240(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MCF537x
Package Tray
Product Status Not For New Designs
Core Processor Coldfire V3
Core Size 32-Bit Single-Core
Speed 240MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals DMA, POR, PWM, WDT
Number of I/O 62
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 32K x 8
Voltage - Supply (Vcc/Vdd) 1.4V ~ 3.6V
Data Converters -
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 196-LBGA
Supplier Device Package 196-LBGA (15x15)
Base Product Number MCF5372
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935319234557
Standard Package 630
Coldfire V3 MCF537x Microcontroller IC 32-Bit Single-Core 240MHz ROMless 196-LBGA (15x15)
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