NXP USA Inc. MM908E622ACPEK

MM908E622ACPEK


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MM908E622ACPEK
  • Package: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: MM908E622ACPEK(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tube
Product Status Active
Digi-Key Programmable Not Verified
Applications Automotive Mirror Control
Core Processor HC08
Program Memory Type FLASH (16kB)
Controller Series 908E
RAM Size 512 x 8
Interface SCI, SPI
Number of I/O 12
Voltage - Supply 9V ~ 16V
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package 54-SOIC-EP
Base Product Number MM908E622
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Other Names 935310229574
Standard Package 26
Contact Information
close