NXP USA Inc. MPC555LFMZP40

MPC555LFMZP40


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC555LFMZP40
  • Package: 272-BBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: MPC555LFMZP40(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MPC5xx
Package Tray
Product Status Not For New Designs
Core Processor PowerPC
Core Size 32-Bit Single-Core
Speed 40MHz
Connectivity CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals POR, PWM, WDT
Number of I/O 101
Program Memory Size 448KB (448K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 26K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 32x10b
Oscillator Type External
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 272-BBGA
Supplier Device Package 272-PBGA (27x27)
Base Product Number MPC555
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935316699557
Standard Package 200
PowerPC MPC5xx Microcontroller IC 32-Bit Single-Core 40MHz 448KB (448K x 8) FLASH 272-PBGA (27x27)
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