NXP USA Inc. MPC860TCZQ66D4

MPC860TCZQ66D4


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: MPC860TCZQ66D4
  • Package: 357-BBGA
  • Datasheet: -
  • Stock: In stock
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Mfr NXP USA Inc.
Series MPC86xx
Package Bulk
Product Status Obsolete
Core Processor MPC860
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 66MHz
Co-Processors/DSP Communications; CPM
RAM Controllers DRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10Mbps (4), 10/100Mbps (1)
SATA -
USB -
Voltage - I/O 3.3V
Operating Temperature -40°C ~ 95°C (TJ)
Security Features -
Mounting Type Surface Mount
Package / Case 357-BBGA
Supplier Device Package 357-PBGA (25x25)
Additional Interfaces HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH info available upon request
ECCN 5A991B4B
HTSUS 8542.31.0000
Other Names 2832-MPC860TCZQ66D4
Standard Package 1
MPC860 Microprocessor IC MPC86xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
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