P1011NXN2HFB

P1011NXN2HFB


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: P1011NXN2HFB
  • Package: 689-BBGA Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
If you have any question, please feel free to contact with us.We will reply you within 24 hours.

Details

Tags

Parameters
Series QorIQ P1
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status ROHS3 Compliant
Package / Case 689-BBGA Exposed Pad
Mfr NXP USA Inc.
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C (TA)
Supplier Device Package 689-TEPBGA II (31x31)
Speed 800MHz
Ethernet 10/100/1000Mbps (3)
USB USB 2.0 + PHY (2)
SATA -
Core Processor PowerPC e500v2
Voltage - I/O -
Number of Cores/Bus Width 1 Core, 32-Bit
Graphics Acceleration No
RAM Controllers DDR2, DDR3
Co-Processors/DSP -
Security Features -
Display & Interface Controllers -
Additional Interfaces DUART, I²C, MMC/SD, SPI
Package Tray
Product Status Obsolete
Base Product Number P1011
REACH Status REACH Unaffected
Other Names 935310413557
Standard Package 27
ECCN 3A991A2
HTSUS 8542.31.0001

P1011NXN2HFB embedded processor 32-Bit 800MHz 

The P1011NXN2HFB is a high-performance embedded processor designed for a wide range of applications, including industrial control, communication equipment, and networking. It features a PowerPC e500v2 core, providing robust processing capabilities with a clock frequency of up to 800 MHz. The chip is equipped with a DDR2/DDR3 ECC memory controller, ensuring reliable data storage and processing. It also supports multiple high-speed interfaces such as four-channel SerDes (up to 2.5GHz), PCIe, and SGMII, making it highly adaptable for various communication standards.

P1011NXN2HFB Microprocessor Specifications and Applications

The P1011NXN2HFB is manufactured using a 45nm low-power process, contributing to its energy efficiency. It has a single-core configuration with a 32-bit bus width. The chip operates within a temperature range of -40°C to 105°C, making it suitable for harsh industrial environments. It also features 256KB of L2 cache, enhancing its performance in data-intensive tasks. The device is packaged in a 689-TEPBGA form factor, which is ideal for compact and high-density designs.

This processor is widely used in multi-service gateways, Ethernet switch controllers, wireless LAN access points, and high-performance general-purpose control processors with strict temperature limitations. Its advanced security features and rich set of interfaces make it a preferred choice for networking, telecommunications, aerospace, defense, and industrial control markets. The P1011NXN2HFB is particularly well-suited for applications requiring high reliability and performance, such as industrial automation systems and communication infrastructure.

Alternative embedded processor Models

● P1011NSE2HFB: This model from NXP features a similar PowerPC e500 core and supports DDR2/DDR3 memory, making it a viable alternative for applications requiring high-speed data processing.

● P1021NXN2HFB: Offering a slightly higher performance with additional USB 2.0 interfaces, this chip is suitable for applications needing enhanced connectivity options.

● P1014NXN5HHA: With a focus on networking capabilities, this model provides robust Ethernet support and is ideal for applications in the telecommunications sector.

Contact Information
close