NXP USA Inc. SPC5744BBK1AMMH6

SPC5744BBK1AMMH6


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SPC5744BBK1AMMH6
  • Package: 100-LFBGA
  • Datasheet: -
  • Stock: In stock
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Mfr NXP USA Inc.
Series MPC57xx
Package Tray
Product Status Active
Core Processor e200z4
Core Size 32-Bit Single-Core
Speed 160MHz
Connectivity CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals DMA, I²S, POR, WDT
Program Memory Size 1.5MB (1.5M x 8)
Program Memory Type FLASH
EEPROM Size 64K x 8
RAM Size 192K x 8
Voltage - Supply (Vcc/Vdd) 3.15V ~ 5.5V
Data Converters A/D 36x10b, 16x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 100-LFBGA
Supplier Device Package 100-MAPBGA (11x11)
Base Product Number SPC5744
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001
Other Names 935368921557
Standard Package 880
e200z4 MPC57xx Microcontroller IC 32-Bit Single-Core 160MHz 1.5MB (1.5M x 8) FLASH 100-MAPBGA (11x11)
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