CL10B105KQ8VPJC


  • Manufacturer: Samsung Electro-Mechanics
  • CONEVO NO: CL10B105KQ8VPJC
  • Package: 0603 (1608 Metric)
  • Stock: In stock
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Details

Tags

Parameters
Series CL
Part Status Active
Voltage - Rated 6.3V
Package / Case 0603 (1608 Metric)
Mounting Type Surface Mount, MLCC
Operating Temperature -55°C ~ 125°C
Size / Dimension 0.063" L x 0.031" W (1.60mm x 0.80mm)
Ratings AEC-Q200
Capacitance 1 µF
Tolerance ±10%
Temperature Coefficient X7R
Applications Automotive, Boardflex Sensitive
Lead Spacing -
Failure Rate -
Lead Style -
Thickness (Max) 0.035" (0.90mm)
Features Soft Termination
RoHS RoHS
Height - Seated (Max) -

CL10B105KQ8VPJC MLCC Capacitor 1UF 6.3V X7R 0603

The CL10B105KQ8VPJC is a general-purpose, surface-mount multilayer ceramic capacitor (MLCC) from Samsung Electro-Mechanics, designed to provide reliable capacitance for decoupling, filtering, and bypass applications in a vast array of consumer and industrial electronic circuits. This component belongs to Samsung's CL series of chip capacitors, known for their robust construction and stable performance.

A key feature of this capacitor is its 1µF (105) capacitance with a ±10% tolerance and a 25V DC voltage rating, housed in the compact and industry-standard 0603 (1608 metric) case size. It utilizes a stable X7R dielectric material, which ensures a relatively stable capacitance with a maximum variation of ±15% over the operating temperature range of -55°C to +125°C. This makes it suitable for applications where moderate stability under varying environmental conditions is required.

‌Alternative Ceramic Capacitor Models

‌1. Murata GRM188R71E105KA12D :‌ A 1µF, 25V X7R dielectric MLCC in an 0603 package, offering high reliability and stable performance for general-purpose decoupling.

2. KEMET‌ C0603X105K3RACTU:‌ A 1µF, 25V X7R ceramic capacitor in an 0603 case, designed for high-volume commercial and industrial applications.

3. Vishay VJ0603Y105KXAPW5BC:‌ A 1µF, 25V X7R MLCC in an 0603 package, suitable for a wide range of bypass and filtering applications in compact designs.

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