SK Hynix H9TQ17ABJTCCUR-KUM
| Parameters | |
|---|---|
| Series | H9TQ17ABJTCCUR-KUM |
| Package / Case | FBGA-221 |
| Mfr | SK Hynix |
| Mounting Type | Surface Mount |
| Type | EMCP |
| Operating Temperature (Max) | 85 ℃ |
| Operating Temperature (Min) | -25 ℃ |
| Voltage | 2.7V~3.6V |
| Speed | 200 MHZ |
| Features | EMMC/EMCP SMD Memory IC Chip |
SK Hynix H9TQ17ABJTCCUR-KUM is a multi-chip package product with integrated storage and memory produced by SK Hynix, a well-known semiconductor manufacturer in South Korea. The SK Hynix H9TQ17ABJTCCUR-KUM contains 16GB of eMMC flash memory and 16GB of LPDDR3 memory. The product is packaged in FBGA-221 and is lead-free and environmentally friendly. It operates in a voltage range of 2.7V to 3.6V, is capable of stable operation in a temperature range of -25°C to +85°C, and operates at a speed of 200MHz. This integrated design makes the H9TQ17ABJTCCUR-KUM ideal for applications that require high capacity storage and memory.
Main features of H9TQ17ABJTCCUR-KUM:
e-NAND: Compatible with eMMC 5.0, supports 1-bit (default), 4-bit, and 8-bit data bus widths, data transfer rates up to 400MB/s (HS400), MMC interface clock frequencies up to 0-200mhz, and startup frequencies up to 0-52mhz.
LPDDR3: has 1.8V VDD1 (1.7V to 1.95V), and 1.2V VDD2, VDDCA, and VDDQ (1.14V to 1.30V), and supports HSUL_12 interface (1.2V high-speed unterminated logic).
Smart Controller: The built-in smart controller manages interface protocols, wear balancing, bad block management, garbage collection, and ECC to protect data content from sudden host power outages.
Compatibility: Compatible with JEDEC standard eMMC 5.0 specification.
H9TQ17ABJTCCUR-KUM Application:
Due to its high integration and superior performance, SK Hynix H9TQ17ABJTCCUR-KUM is widely used in a variety of electronic products, such as smartphones, tablets, in-vehicle infotainment systems, high-end cameras and other portable devices requiring high capacity storage and memory. This integrated storage solution helps reduce the size of the device while providing the required performance and reliability.
