XC2S100E-6FGG456C

Introducing the highly-efficient and versatile XC2S100E-6FGG456C FPGA from our esteemed hardware solutions brand. Designed with the utmost precision and advanced technology, this cutting-edge FPGA offers exceptional performance for a wide range of applications. Boasting a generous capacity of 100,000 system gates, the XC2S100E-6FGG456C provides ample room for complex designs and facilitates quick and efficient development cycles. The FPGA's high-speed I/O capabilities ensure smooth data transfer, enabling seamless integration with other devices and systems. Equipped with 6-input lookup tables (LUTs) and flip-flops, this FPGA allows for the implementation of complex logic functions and enables the design of intricate digital circuits. The robust design of the XC2S100E-6FGG456C ensures reliability and resilience in even the most demanding environments. Additionally, this FPGA features the latest electronic design automation (EDA) tools and software support, simplifying the development process and reducing time to market. Its low power consumption makes it an ideal choice for power-sensitive applications, ensuring energy efficiency. Experience unparalleled performance and flexibility with the XC2S100E-6FGG456C FPGA, the ultimate solution for your innovative hardware designs.

banner

Other Products

View More
  • 1779-1411-ND

    1779-1411-ND

  • 1779-1277-ND

    1779-1277-ND

  • 1779-1325-ND

    1779-1325-ND

  • 3645-VTM120-4-ND

    3645-VTM120-4-ND

  • 3645-STM50LC-02-ND

    3645-STM50LC-02-ND

  • 1779-1335-ND

    1779-1335-ND

  • 495-5536-ND

    495-5536-ND

  • 1779-1290-ND

    1779-1290-ND

  • 1779-1271-ND

    1779-1271-ND

  • 495-75368-ND

    495-75368-ND

  • 1779-1421-ND

    1779-1421-ND

  • 495-5416-ND

    495-5416-ND

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close