XC3S200-4TQG144I

Introducing the XC3S200-4TQG144I, a cutting-edge programmable logic device revolutionizing the field of embedded systems and digital design. Developed by leading semiconductor manufacturer Xilinx, this product offers unmatched flexibility and performance for a wide range of applications. The XC3S200-4TQG144I features a Spartan-3 digital logic technology, enabling designers to implement complex digital systems with ease. With a generous capacity of 200,000 system gates, this device offers ample room for creative and innovative designs. This programmable logic device also brings a range of benefits to the table. With its 1.5V to 3.3V voltage support, the XC3S200-4TQG144I is compatible with a wide variety of platforms. Its fast 3.2V Multi-Output Programmable Power Supply (MPPS) ensures excellent power efficiency and reliability. Designed to adapt to changing requirements, the XC3S200-4TQG144I boasts advanced features such as JTAG boundary scan, multiple power options, and efficient system integration. With its robust design and high-quality manufacturing, this product guarantees lasting performance and stability. Whether you are working on telecommunications, automotive, consumer electronics, or any other demanding application, the XC3S200-4TQG144I is the ideal solution for your digital design needs. Experience unrivaled flexibility and performance with this exceptional programmable logic device from Xilinx.

banner

Other Products

View More
  • 1175-1714-ND

    1175-1714-ND

  • 1779-BH2EE04221204U000P-ND

    1779-BH2EE04221204U000P-ND

  • U80/65/32-3C90-ND

    U80/65/32-3C90-ND

  • ER48/21/21-3C94-ND

    ER48/21/21-3C94-ND

  • 1779-1356-ND

    1779-1356-ND

  • B65525J0000R001-ND

    B65525J0000R001-ND

  • PQ35/30-3C94-ND

    PQ35/30-3C94-ND

  • 1779-1078-ND

    1779-1078-ND

  • 1779-AE4RM00800001B0NPS-ND

    1779-AE4RM00800001B0NPS-ND

  • 9595424402-ND

    9595424402-ND

  • RM10/I-3C97-A630-ND

    RM10/I-3C97-A630-ND

  • P11/7-3F36-ND

    P11/7-3F36-ND

Related Blogs

  • 2026 / 03 / 10

    TI Launches Second Comprehensive Price Increase

    TI announced a second price hike of 15-85% effective April 1, 2026, covering digital isolators, PMICs, and other core products. ...

    TI Launches Second Comprehensive Price Increase
  • 2026 / 03 / 09

    Merger: DENSO Plans ¥1.3 Trillion Acquisition of ROHM

    DENSO's ¥1.3 trillion bid for ROHM signals Japan's shift from collaborative partnerships to capital-driven consolidation in power semiconductors....

    Merger: DENSO Plans ¥1.3 Trillion Acquisition of ROHM
  • 2026 / 03 / 06

    ASML Strategic Planning: Potential Expansion into Advanced Packaging

    ASML plans to expand from EUV lithography into advanced packaging and chip bonding equipment over the next 10-15 years, targeting the growing AI chip market....

    ASML Strategic Planning: Potential Expansion into Advanced Packaging
  • 2026 / 03 / 05

    Hot Chip Guide: In-Depth Analysis of IC Component

    A comprehensive guide to popular ICs across microcontrollers, FPGAs, power management, op-amps, memory, and discrete power devices....

    Hot Chip Guide: In-Depth Analysis of IC Component
  • 2026 / 03 / 04

    KEMET Implements Third Tantalum Capacitor Price Hike Within Nine Months

    KEMET, Yageo's subsidiary, announced its third tantalum capacitor price hike in nine months, effective April 2026. The adjustment targets T523 series polymer capacitors....

    KEMET Implements Third Tantalum Capacitor Price Hike Within Nine Months
  • 2026 / 03 / 03

    China's CIS Leader SmartSens Announces Price Increases

    SmartSens, China's CIS leader, raises prices 10-20% from March 1, with higher increases for Samsung-foundry products than Nexchip-made ones....

    China's CIS Leader SmartSens Announces Price Increases
  • 2026 / 03 / 02

    Semiconductor Devices: In-Depth Analysis of Digital Isolators

    Digital Isolators - CMOS-based semiconductor devices enabling secure signal transmission across electrical barriers. Offering superior speed, efficiency, and longevity compared to optocouplers....

    Semiconductor Devices: In-Depth Analysis of Digital Isolators
  • 2026 / 02 / 28

    Samsung Electronics Halts 2D NAND Production at Hwaseong Line 12

    Samsung Electronics will cease 2D NAND production at Hwaseong Line 12 in March 2026. This marks the end of 24 years of planar flash production....

    Samsung Electronics Halts 2D NAND Production at Hwaseong Line 12
  • 2026 / 02 / 27

    Nexperia China Full Transition its power semiconductors to domestically produced wafers

    Nexperia China completed full localization of IGBT wafer sourcing in January 2026, switching from Dutch suppliers to domestic manufacturers including Wingskysemi and GTA Semiconductor. ...

    Nexperia China Full Transition its power semiconductors to domestically produced wafers
  • 2026 / 02 / 26

    Micron Officially Enters the GDDR7 3GB Competition

    Micron launches 3GB GDDR7 memory at 36Gbps, joining Samsung (42.5Gbps) and SK Hynix (40Gbps) in the high-capacity graphics memory race. ...

    Micron Officially Enters the GDDR7 3GB Competition
Contact Information
close