XC4VFX60-10FFG672I

Introducing the XC4VFX60-10FFG672I, a high-performance FPGA (Field Programmable Gate Array) that offers remarkable power, flexibility, and versatility for a wide range of applications. This advanced programmable device is designed to meet the demanding requirements of today's technology-driven world. Featuring a powerful Xilinx Virtex-4 FPGA architecture, the XC4VFX60-10FFG672I delivers exceptional performance and scalability. With its 60,000 logic cells, this FPGA offers an abundant amount of resources to implement complex designs and support data-intensive applications. The device also includes a flexible 10 Gigabit Ethernet interface, enabling high-speed connectivity and data transfer. Built with state-of-the-art technology, the XC4VFX60-10FFG672I offers unrivaled flexibility for design changes and updates. Its programmable nature allows for easy modifications to meet evolving project needs, saving both time and costs associated with hardware redesigns. Additionally, this FPGA supports various embedded processor cores, enabling seamless integration with existing software systems. Whether you are working on advanced telecom systems, high-performance computing, or aerospace and defense applications, the XC4VFX60-10FFG672I provides the performance, flexibility, and reliability required to meet your most demanding project requirements. Trust Xilinx, a leader in FPGA technology, to deliver the best-in-class solutions for your digital design needs.

banner

Other Products

View More
  • MaxLinear, Inc. XR16M770IL32-F

    MaxLinear, Inc. XR16M770IL32-F

  • Intersil IP82C52

    Intersil IP82C52

  • NXP USA Inc. SC16C654BIEC,528

    NXP USA Inc. SC16C654BIEC,528

  • MaxLinear, Inc. XR16C850CJ-F

    MaxLinear, Inc. XR16C850CJ-F

  • MaxLinear, Inc. ST16C654CQ100-F

    MaxLinear, Inc. ST16C654CQ100-F

  • Texas Instruments TL16C550CFNRG4

    Texas Instruments TL16C550CFNRG4

  • Texas Instruments TL16C550DIPTG4

    Texas Instruments TL16C550DIPTG4

  • Renesas Electronics America Inc ID82C52

    Renesas Electronics America Inc ID82C52

  • MaxLinear, Inc. XR68C92CJ-F

    MaxLinear, Inc. XR68C92CJ-F

  • MaxLinear, Inc. XR16M2550IM48-F

    MaxLinear, Inc. XR16M2550IM48-F

  • Texas Instruments TL16C550DIRHBR

    Texas Instruments TL16C550DIRHBR

  • NXP USA Inc. SC16C750IB64,157

    NXP USA Inc. SC16C750IB64,157

Related Blogs

  • 2026 / 03 / 05

    Hot Chip Guide: In-Depth Analysis of IC Component

    A comprehensive guide to popular ICs across microcontrollers, FPGAs, power management, op-amps, memory, and discrete power devices....

    Hot Chip Guide: In-Depth Analysis of IC Component
  • 2026 / 03 / 04

    KEMET Implements Third Tantalum Capacitor Price Hike Within Nine Months

    KEMET, Yageo's subsidiary, announced its third tantalum capacitor price hike in nine months, effective April 2026. The adjustment targets T523 series polymer capacitors....

    KEMET Implements Third Tantalum Capacitor Price Hike Within Nine Months
  • 2026 / 03 / 03

    China's CIS Leader SmartSens Announces Price Increases

    SmartSens, China's CIS leader, raises prices 10-20% from March 1, with higher increases for Samsung-foundry products than Nexchip-made ones....

    China's CIS Leader SmartSens Announces Price Increases
  • 2026 / 03 / 02

    Semiconductor Devices: In-Depth Analysis of Digital Isolators

    Digital Isolators - CMOS-based semiconductor devices enabling secure signal transmission across electrical barriers. Offering superior speed, efficiency, and longevity compared to optocouplers....

    Semiconductor Devices: In-Depth Analysis of Digital Isolators
  • 2026 / 02 / 28

    Samsung Electronics Halts 2D NAND Production at Hwaseong Line 12

    Samsung Electronics will cease 2D NAND production at Hwaseong Line 12 in March 2026. This marks the end of 24 years of planar flash production....

    Samsung Electronics Halts 2D NAND Production at Hwaseong Line 12
  • 2026 / 02 / 27

    Nexperia China Full Transition its power semiconductors to domestically produced wafers

    Nexperia China completed full localization of IGBT wafer sourcing in January 2026, switching from Dutch suppliers to domestic manufacturers including Wingskysemi and GTA Semiconductor. ...

    Nexperia China Full Transition its power semiconductors to domestically produced wafers
  • 2026 / 02 / 26

    Micron Officially Enters the GDDR7 3GB Competition

    Micron launches 3GB GDDR7 memory at 36Gbps, joining Samsung (42.5Gbps) and SK Hynix (40Gbps) in the high-capacity graphics memory race. ...

    Micron Officially Enters the GDDR7 3GB Competition
  • 2026 / 02 / 25

    AI Computing Power Ignites Passive Components: MLCC Price Increases

    MLCC prices set to rise as AI demand surges. Murata considers hikes while Samsung Electro-Mechanics' Tianjin plant hits full capacity, squeezing mid-range supply....

    AI Computing Power Ignites Passive Components: MLCC Price Increases
  • 2026 / 02 / 11

    TSMC Exits Mature Processes: 80% of 8-inch Capacity Transferred to VIS

    TSMC transfers 80% of its 8-inch capacity to VIS, exiting mature processes to focus on AI-driven advanced nodes below 3nm, while VIS doubles capacity to dominate the global 8-inch foundry market....

    TSMC Exits Mature Processes: 80% of 8-inch Capacity Transferred to VIS
  • 2026 / 02 / 10

    Sharp to Close LCD Panel Subsidiary "Sharp Yonago"

    Sharp will close its LCD subsidiary Sharp Yonago by July 2026. The move follows the 2024 shutdown of its Sakai factory and plans to sell the Kameyama No. 2 plant....

    Sharp to Close LCD Panel Subsidiary "Sharp Yonago"
Contact Information
close