XC6SLX45-2FGG484i

Introducing the XC6SLX45-2FGG484i, a high-performance FPGA (Field-Programmable Gate Array) designed to revolutionize your digital circuit design experience. This powerful programmable logic device is equipped with advanced features and capabilities, making it the ideal choice for a wide range of applications. Boasting a capacity of 44,640 logic cells, the XC6SLX45-2FGG484i enables you to implement complex digital circuits with ease. With a robust combination of high-speed connectivity options including configurable I/O standards, differential signaling, and clock management resources, this FPGA empowers you to achieve blazing-fast data transfer rates and seamless integration of external devices. Built on advanced 45nm technology, the XC6SLX45-2FGG484i delivers exceptional power efficiency without compromising on performance. Its low power consumption ensures longer battery life, making it perfect for portable and handheld devices. Additionally, the device features embedded memory blocks, DSP slices, and versatile programmable interconnects, providing a highly flexible and scalable platform for your design needs. Unlock the full potential of your digital circuit designs with the XC6SLX45-2FGG484i FPGA. Whether you are designing for telecommunications, medical devices, industrial control systems, or any other application, this cutting-edge FPGA delivers the performance, versatility, and power efficiency required for success.

banner

Other Products

View More
  • 475-GWJTLPSC.EM-L24L26-6500-1-150-R18TR-ND

    475-GWJTLPSC.EM-L24L26-6500-1-150-R18TR-ND

  • GWJCLPS1.EM-HPHR-A333-1-65-R18-ND

    GWJCLPS1.EM-HPHR-A333-1-65-R18-ND

  • MX6AWT-H1-0000-0009Z8-ND

    MX6AWT-H1-0000-0009Z8-ND

  • 1214-1310-2-ND,1214-1310-1-ND,1214-1310-6-ND

    1214-1310-2-ND,1214-1310-1-ND,1214-1310-6-ND

  • 475-GWJTLPS2.CM-JLJN-A131-1-150-R33TR-ND

    475-GWJTLPS2.CM-JLJN-A131-1-150-R33TR-ND

  • XPEBWT-L1-0000-00BZ5TR-ND,XPEBWT-L1-0000-00BZ5CT-ND,XPEBWT-L1-0000-00BZ5DKR-ND

    XPEBWT-L1-0000-00BZ5TR-ND,XPEBWT-L1-0000-00BZ5CT-ND,XPEBWT-L1-0000-00BZ5DKR-ND

  • 475-GWJTLPS1.EM-KLLL-XX56-1-150-R33TR-ND

    475-GWJTLPS1.EM-KLLL-XX56-1-150-R33TR-ND

  • MX6AWT-A1-R250-0009A4-ND

    MX6AWT-A1-R250-0009A4-ND

  • MX6AWT-A1-R250-0009B2-ND

    MX6AWT-A1-R250-0009B2-ND

  • GWJCLPS1.EM-GTHP-A838-1-65-R18-ND

    GWJCLPS1.EM-GTHP-A838-1-65-R18-ND

  • GWJDSLS1.EC-FRFT-5C8D-1-ND

    GWJDSLS1.EC-FRFT-5C8D-1-ND

  • MCE4WT-A2-0000-000M08-ND

    MCE4WT-A2-0000-000M08-ND

Related Blogs

  • 2026 / 03 / 02

    Semiconductor Devices: In-Depth Analysis of Digital Isolators

    Digital Isolators - CMOS-based semiconductor devices enabling secure signal transmission across electrical barriers. Offering superior speed, efficiency, and longevity compared to optocouplers....

    Semiconductor Devices: In-Depth Analysis of Digital Isolators
  • 2026 / 02 / 28

    Samsung Electronics Halts 2D NAND Production at Hwaseong Line 12

    Samsung Electronics will cease 2D NAND production at Hwaseong Line 12 in March 2026. This marks the end of 24 years of planar flash production....

    Samsung Electronics Halts 2D NAND Production at Hwaseong Line 12
  • 2026 / 02 / 27

    Nexperia China Full Transition its power semiconductors to domestically produced wafers

    Nexperia China completed full localization of IGBT wafer sourcing in January 2026, switching from Dutch suppliers to domestic manufacturers including Wingskysemi and GTA Semiconductor. ...

    Nexperia China Full Transition its power semiconductors to domestically produced wafers
  • 2026 / 02 / 26

    Micron Officially Enters the GDDR7 3GB Competition

    Micron launches 3GB GDDR7 memory at 36Gbps, joining Samsung (42.5Gbps) and SK Hynix (40Gbps) in the high-capacity graphics memory race. ...

    Micron Officially Enters the GDDR7 3GB Competition
  • 2026 / 02 / 25

    AI Computing Power Ignites Passive Components: MLCC Price Increases

    MLCC prices set to rise as AI demand surges. Murata considers hikes while Samsung Electro-Mechanics' Tianjin plant hits full capacity, squeezing mid-range supply....

    AI Computing Power Ignites Passive Components: MLCC Price Increases
  • 2026 / 02 / 11

    TSMC Exits Mature Processes: 80% of 8-inch Capacity Transferred to VIS

    TSMC transfers 80% of its 8-inch capacity to VIS, exiting mature processes to focus on AI-driven advanced nodes below 3nm, while VIS doubles capacity to dominate the global 8-inch foundry market....

    TSMC Exits Mature Processes: 80% of 8-inch Capacity Transferred to VIS
  • 2026 / 02 / 10

    Sharp to Close LCD Panel Subsidiary "Sharp Yonago"

    Sharp will close its LCD subsidiary Sharp Yonago by July 2026. The move follows the 2024 shutdown of its Sakai factory and plans to sell the Kameyama No. 2 plant....

    Sharp to Close LCD Panel Subsidiary "Sharp Yonago"
  • 2026 / 02 / 09

    Renesas Electronics Reports First Loss in Six Years, Divests Timing Business for $3 Billion

    Renesas Electronics forecasts its first net loss in six years (¥51.7B) for FY2025 due to Wolfspeed's bankruptcy impairment and weak automotive demand. ...

    Renesas Electronics Reports First Loss in Six Years, Divests Timing Business for $3 Billion
  • 2026 / 02 / 07

    ADUM Series Digital Isolators: Technical Analysis, Model Selection, and Application Guide

    The ADUM series digital isolators from Analog Devices utilize proprietary iCoupler® technology with on-chip transformers, offering superior performance over traditional optocouplers. ...

    ADUM Series Digital Isolators: Technical Analysis, Model Selection, and Application Guide
  • 2026 / 02 / 05

    Infineon Acquires ams OSRAM Sensor Business for €570 Million

    Infineon acquires ams OSRAM's non-optical sensor business for €570M. The deal strengthens Infineon's automotive, industrial and medical sensor portfolio....

    Infineon Acquires ams OSRAM Sensor Business for €570 Million
Contact Information
close