1.5KE100(C)

Introducing the 1.5KE100(C) - a reliable, high-performance Transient Voltage Suppressor Diode (TVS) designed to protect sensitive electronic devices from voltage surges. With a peak power dissipation of 1.5kW and a breakdown voltage of 100V, this TVS diode offers exceptional surge protection capabilities. It is specifically created to effectively divert excess transient voltage away from sensitive components, safeguarding them against potential damage. The 1.5KE100(C) is housed in a compact DO-201AD package, making it easy to integrate into various electronic applications. Its low clamping voltage and fast response time ensure optimum protection, maintaining the longevity and functionality of your electronic devices. This device is suitable for use in a wide range of applications, including power supplies, motor control systems, telecommunication equipment, and automotive electronics. Engineered with industry-leading technology, the 1.5KE100(C) sets a new standard for TVS diodes. Trust in its superior protection capabilities and reliable performance to safeguard your electronic devices from harmful surges and ensure uninterrupted operation even in the face of transient voltage events.

banner

Other Products

View More
  • Analog Devices Inc./Maxim Integrated DS1260-100

    Analog Devices Inc./Maxim Integrated DS1260-100

  • STMicroelectronics M4Z28-BR00SH1

    STMicroelectronics M4Z28-BR00SH1

  • Analog Devices Inc./Maxim Integrated DS9034PCI+

    Analog Devices Inc./Maxim Integrated DS9034PCI+

  • Analog Devices Inc./Maxim Integrated DS9034PC

    Analog Devices Inc./Maxim Integrated DS9034PC

  • Analog Devices Inc./Maxim Integrated DS9034PC+

    Analog Devices Inc./Maxim Integrated DS9034PC+

  • Analog Devices Inc./Maxim Integrated DS9034PCI

    Analog Devices Inc./Maxim Integrated DS9034PCI

  • Analog Devices Inc./Maxim Integrated DS9034I-PCX+

    Analog Devices Inc./Maxim Integrated DS9034I-PCX+

  • Analog Devices Inc./Maxim Integrated DS1260-50

    Analog Devices Inc./Maxim Integrated DS1260-50

  • STMicroelectronics M4Z32-BR00SH1

    STMicroelectronics M4Z32-BR00SH1

  • Analog Devices Inc./Maxim Integrated DS9034PCX+

    Analog Devices Inc./Maxim Integrated DS9034PCX+

  • Analog Devices Inc./Maxim Integrated DS90340I-PCX

    Analog Devices Inc./Maxim Integrated DS90340I-PCX

  • Analog Devices Inc./Maxim Integrated DS1260-25

    Analog Devices Inc./Maxim Integrated DS1260-25

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close