1.5KE7.5(C)A

Introducing the 1.5KE7.5(C)A, a high-performance transorb diode designed to protect sensitive electronic devices from voltage spikes and surges. This compact and versatile device is ideal for a wide range of applications, including telecommunications, automotive, industrial, and consumer electronics. With a peak power dissipation of 1500W, the 1.5KE7.5(C)A can handle high-energy transients with ease, ensuring reliable protection for your valuable equipment. Its low clamping voltage and fast response time provide effective suppression of voltage spikes, safeguarding against damage caused by electrical disturbances. The 1.5KE7.5(C)A is rated for a breakdown voltage of 7.5V, making it suitable for use in low voltage circuits. Its compact DO-201 package allows for easy integration into existing designs and provides space-saving benefits. Manufactured using high-quality materials and rigorous quality control processes, the 1.5KE7.5(C)A offers excellent stability, reliability, and performance. Whether you need protection for sensitive communication systems, automotive electronics, or industrial machinery, the 1.5KE7.5(C)A is the go-to choice for reliable surge protection.

banner

Other Products

View More
  • Analog Devices Inc./Maxim Integrated DS9034PCI

    Analog Devices Inc./Maxim Integrated DS9034PCI

  • Analog Devices Inc./Maxim Integrated DS9034PCX+

    Analog Devices Inc./Maxim Integrated DS9034PCX+

  • Analog Devices Inc./Maxim Integrated DS9034PCI+

    Analog Devices Inc./Maxim Integrated DS9034PCI+

  • Analog Devices Inc./Maxim Integrated DS1260-25

    Analog Devices Inc./Maxim Integrated DS1260-25

  • Analog Devices Inc./Maxim Integrated DS9034PC

    Analog Devices Inc./Maxim Integrated DS9034PC

  • STMicroelectronics M4Z32-BR00SH1

    STMicroelectronics M4Z32-BR00SH1

  • Analog Devices Inc./Maxim Integrated DS9034PC+

    Analog Devices Inc./Maxim Integrated DS9034PC+

  • Analog Devices Inc./Maxim Integrated DS1260-100

    Analog Devices Inc./Maxim Integrated DS1260-100

  • Analog Devices Inc./Maxim Integrated DS1260-50

    Analog Devices Inc./Maxim Integrated DS1260-50

  • STMicroelectronics M4Z28-BR00SH1

    STMicroelectronics M4Z28-BR00SH1

  • Analog Devices Inc./Maxim Integrated DS90340I-PCX

    Analog Devices Inc./Maxim Integrated DS90340I-PCX

  • Analog Devices Inc./Maxim Integrated DS9034PCX

    Analog Devices Inc./Maxim Integrated DS9034PCX

Related Blogs

  • 2026 / 07 / 31

    Holtek Increase Product Prices 10% - 20%

    Holtek Semiconductor announces a sweeping 10%-20% price hike across its MCU portfolio, driven by relentless cost pressures from packaging and foundry partners....

    Holtek Increase Product Prices 10% - 20%
  • 2026 / 07 / 30

    UMC Bets $4.6B on Silicon Photonics, Dual-Track Expansion Plan

    UMC commits $4.6B to silicon photonics expansion, fast-tracking Singapore P4 fab for immediate capacity while breaking ground on Tainan P7/P8....

    UMC Bets $4.6B on Silicon Photonics, Dual-Track Expansion Plan
  • 2026 / 07 / 29

    MLCC Price Increase: Samsung Electro-Mechanics and Taiyo Follow in Raising Prices

    MLCC prices surge again: Samsung hikes 30%, Taiyo Yuden raises prices amid severe shortages. AI servers use 8-10x more MLCC, pushing lead times beyond 20 weeks. ...

    MLCC Price Increase: Samsung Electro-Mechanics and Taiyo Follow in Raising Prices
  • 2026 / 07 / 28

    Microchip Acquires Israeli Edge AI Chip Company Hailo

    Microchip buys Hailo to expand edge AI processing, integrating accelerators and vision SoCs. The acquisition closes in September 2026....

    Microchip Acquires Israeli Edge AI Chip Company Hailo
  • 2026 / 07 / 27

    Qualcomm Chip Prices, Up Double-Digit Percentage

    Qualcomm announces double-digit chip price hikes from September 1 as AI-driven supply shortages and surging DRAM costs bite. ...

    Qualcomm Chip Prices, Up Double-Digit Percentage
  • 2026 / 07 / 24

    NVIDIA Invests $1.5 Billion in Amkor for Advanced Packaging Capacity Expansion

    NVIDIA's $1.5B prepayment to Amkor expands U.S. advanced packaging capacity in Arizona, securing AI chip supply, reducing Asian dependence, and complementing TSMC's fab....

    NVIDIA Invests $1.5 Billion in Amkor for Advanced Packaging Capacity Expansion
  • 2026 / 07 / 23

    AMD and Anthropic Reach Multimillion‑Dollar AI Server Procurement Agreement

    AMD and Anthropic sign AI server pact: 2GW MI450 GPUs in Helios racks, $5B AMD equity investment, first 1GW deployment starting H1 2027....

    AMD and Anthropic Reach Multimillion‑Dollar AI Server Procurement Agreement
  • 2026 / 07 / 22

    ABB Acquires Advantics to Strengthen Silicon Carbide Power Conversion Portfolio

    ABB has acquired Advantics, a French SiC power conversion specialist. The deal strengthens ABB's DC portfolio for data centers, microgrids, and EV infrastructure....

    ABB Acquires Advantics to Strengthen Silicon Carbide Power Conversion Portfolio
  • 2026 / 07 / 21

    TI Popular Components Selection Guide: High-Demand Part Details

    TI's recent popular ICs: precision op amps, battery management, power LDOs, logic/interface, and current‑sense/isolation....

    TI Popular Components Selection Guide: High-Demand Part Details
  • 2026 / 07 / 20

    UMC's Dual-Track Advanced Packaging Strategy: Silicon Interposer and TGV Tech

    UMC's dual bet: silicon interposer and TGV glass substrate integration. A differentiated wafer‑level play to ease CoWoS bottlenecks, with high‑volume ramp targeted for 2027‑28....

    UMC's Dual-Track Advanced Packaging Strategy: Silicon Interposer and TGV Tech
Contact Information
close