AD7894BRZ-3REEL7

Introducing the AD7894BRZ-3REEL7, a high-performance, low-power, 14-bit analog-to-digital converter from Analog Devices. This state-of-the-art device combines precision, speed, and versatility, making it ideal for a wide range of applications in industrial, medical, and communication fields. The AD7894BRZ-3REEL7 boasts an impressive 14-bit resolution, offering exceptional accuracy and precision in converting analog signals into digital data. It operates at a sampling rate of up to 200 kSPS, ensuring real-time conversion without sacrificing quality. One of the key features of this converter is its low power consumption, making it suitable for battery-powered applications. Its low power sleep mode allows for further power savings when not in use, ideal for portable and energy-efficient devices. Designed with a small form factor, the AD7894BRZ-3REEL7 offers ease of integration into various system designs. It also features a wide analog input voltage range of 0 to VREF, providing flexibility for different signal levels. With excellent performance, low power consumption, and compact design, the AD7894BRZ-3REEL7 is the go-to analog-to-digital converter for demanding applications that require high resolution and precision. Upgrade your system today with this outstanding offering from Analog Devices.

banner

Other Products

View More
  • Texas Instruments 74FCT16500CTPVCG4

    Texas Instruments 74FCT16500CTPVCG4

  • Texas Instruments SN74ALVCH16271DLR

    Texas Instruments SN74ALVCH16271DLR

  • Texas Instruments SN74ALVC16835DGVR

    Texas Instruments SN74ALVC16835DGVR

  • Cypress Semiconductor Corp CY74FCT16501ETPVCT

    Cypress Semiconductor Corp CY74FCT16501ETPVCT

  • Texas Instruments SN74ALVC162334DL

    Texas Instruments SN74ALVC162334DL

  • Texas Instruments SN74LVTH16500DL

    Texas Instruments SN74LVTH16500DL

  • Texas Instruments SN74AVC16334DGVR

    Texas Instruments SN74AVC16334DGVR

  • Texas Instruments SN74ALVCH16270DL

    Texas Instruments SN74ALVCH16270DL

  • Texas Instruments SN74GTL16612DLR

    Texas Instruments SN74GTL16612DLR

  • Renesas Electronics America Inc IDT74ALVCH16501PAG8

    Renesas Electronics America Inc IDT74ALVCH16501PAG8

  • Renesas Electronics America Inc 74FCT162500CTPVG

    Renesas Electronics America Inc 74FCT162500CTPVG

  • Texas Instruments SN74ABT162501DGGR

    Texas Instruments SN74ABT162501DGGR

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close