AD8174ARZ

Introducing the AD8174ARZ, a high-performance, quad-channel amplifier from Analog Devices. This versatile device is designed to provide exceptional performance and flexibility in a variety of applications. The AD8174ARZ is capable of delivering excellent signal fidelity with a bandwidth of 3 GHz, making it ideal for use in high-speed data transmission, video distribution, and telecommunications systems. Its wide bandwidth ensures that your signals remain intact, allowing for efficient data transfer and accurate video processing. This amplifier also boasts low-distortion characteristics, ensuring that your signals remain clean and undistorted even at high frequencies. With a low harmonic distortion of -75 dBc and a low differential gain and phase of 0.01% and 0.01 degrees respectively, the AD8174ARZ ensures that your signals are faithfully reproduced, maintaining their integrity throughout the amplification process. Designed with precision and reliability in mind, the AD8174ARZ features a high slew rate of 3000 V/μs, enabling it to quickly respond to fast-changing signals without compromising signal quality. Its wide common-mode range of -1V to +5.5V ensures that it can handle a wide range of input signal levels, making it suitable for a wide range of applications. Whatever your application may be, the AD8174ARZ can deliver superior performance and reliability, making it an ideal choice for your amplification needs.

banner

Other Products

View More
  • AMD XCVU080-2FFVA2104E

    AMD XCVU080-2FFVA2104E

  • Intel EP1S40F1020C5N

    Intel EP1S40F1020C5N

  • Lattice Semiconductor Corporation LCMXO3LF-2100E-6MG121C

    Lattice Semiconductor Corporation LCMXO3LF-2100E-6MG121C

  • AMD XCS20XL-4PQG208C

    AMD XCS20XL-4PQG208C

  • Intel 5SGXMA7N3F40I3G

    Intel 5SGXMA7N3F40I3G

  • Microchip Technology A3PE600-2FGG256I

    Microchip Technology A3PE600-2FGG256I

  • AMD XCVU095-2FFVB2104I

    AMD XCVU095-2FFVB2104I

  • Intel 5SGSMD5H3F35C2N

    Intel 5SGSMD5H3F35C2N

  • Intel 5SGXMA4K2F35C3G

    Intel 5SGXMA4K2F35C3G

  • Intel EP1SGX10CF672C6N

    Intel EP1SGX10CF672C6N

  • Intel 5SGXMB5R3F43I3G

    Intel 5SGXMB5R3F43I3G

  • Intel 5SGXEA5K3F35C2L

    Intel 5SGXEA5K3F35C2L

Related Blogs

  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Contact Information
close