AD8343ARUZ-REEL7

Introducing the AD8343ARUZ-REEL7, a highly efficient and versatile RF mixer from Analog Devices. Designed for high-performance applications, this product offers exceptional functionality, reliability, and precision. The AD8343ARUZ-REEL7 features a wide frequency range and low power consumption, making it ideal for a variety of applications such as wireless communication systems, satellite communication systems, and radar systems. With its innovative design, this RF mixer ensures minimal distortion and high linearity for superior signal quality and accuracy. This mixer also offers a variety of convenient features, including an integrated baseband amplifier, on-chip biasing circuitry, advanced voltage control attenuators, and on-chip reference ports. Furthermore, the AD8343ARUZ-REEL7 is designed to withstand high input power levels, providing unmatched durability and reliability. With its compact size and easy integration, this product is perfect for space-constrained applications. Additionally, the AD8343ARUZ-REEL7 is compliant with industry standards, ensuring seamless compatibility with other components and systems. Whether you're working on a wireless communication project or a radar system, the AD8343ARUZ-REEL7 RF mixer from Analog Devices is an excellent choice for achieving optimal performance and reliability.

banner

Other Products

View More
  • NMP12J-ND

    NMP12J-ND

  • SG4008-ND

    SG4008-ND

  • GMA70400-ND

    GMA70400-ND

  • 1956-1013-ND

    1956-1013-ND

  • SG9286-ND

    SG9286-ND

  • SG9092-ND

    SG9092-ND

  • GHL5R500-ND

    GHL5R500-ND

  • SG3001-ND

    SG3001-ND

  • SG9100-ND

    SG9100-ND

  • EM10HV-ND

    EM10HV-ND

  • TZB4R200EA10R01-ND

    TZB4R200EA10R01-ND

  • SG1031-ND

    SG1031-ND

Related Blogs

  • 2025 / 10 / 16

    Samsung's Memory Innovations: HBM4E and LPDDR6 Lead

    Samsung Electronics is making significant strides in memory technology. It aims to achieve over 3TB/s bandwidth with its seventh-generation HBM4E by 2027, a 2.5x improvement over current HBM3E......

    Samsung's Memory Innovations: HBM4E and LPDDR6 Lead
  • 2025 / 10 / 15

    OpenAI's Hardware Collaboration Strategy: Building a Robust Computing Power Ecosystem

    OpenAI has recently announced three major hardware collaborations with Broadcom, AMD, and NVIDIA, aiming to deploy a total of 26 gigawatts of computing power. ...

    OpenAI's Hardware Collaboration Strategy: Building a Robust Computing Power Ecosystem
  • 2025 / 10 / 14

    Popular IC Components in Recent Times: Performance and Alternatives

    Explores popular IC components known for their exceptional performance and broad applications, like ISO1050DUBR, ADR421ARMZ, XCZU47DR-2FFVE1156I, PCF8563TS/5,118, and STM32G030F6P6TR......

    Popular IC Components in Recent Times: Performance and Alternatives
  • 2025 / 10 / 13

    Wingtech's $14.7B yuan Semiconductor Assets Frozen by Netherlands: Full Story

    On October 12, 2025, Wingtech Technology announced that the Dutch government had frozen assets of its wholly-owned subsidiary Nexperia, valued at 14.7 billion yuan....

    Wingtech's $14.7B yuan Semiconductor Assets Frozen by Netherlands: Full Story
  • 2025 / 10 / 11

    What Is a Voltage-Level Translator?

    Voltage-level translators, also known as level shifters, are crucial for enabling communication between electronic devices operating at different voltage levels. They prevent signal distortion and equipment damage by converting signal voltages accurately. ...

    What Is a Voltage-Level Translator?
  • 2025 / 10 / 10

    NVIDIA Adds Orders for 800G Optical Modules: The Future of Data Centers

    NVIDIA has significantly increased its orders for 800G optical modules for 2026, with a 35% rise in demand. The growing need for high-speed optical modules in data centers, driven by AI, highlights the importance of 800G modules....

    NVIDIA Adds Orders for 800G Optical Modules: The Future of Data Centers
  • 2025 / 10 / 09

    Accelerating Innovation: Altera Expands Its Agilex™ FPGA Portfolio

    Altera is expanding its Agilex™ FPGA portfolio with new hardware and software solutions. The Agilex 5 and Agilex 3 SoC FPGAs are now in mass production, offering low latency and high integration for edge AI and co-processing applications. ...

    Accelerating Innovation: Altera Expands Its Agilex™ FPGA Portfolio
  • 2025 / 09 / 30

    STMicroelectronics' Tour PLP Pilot Line Targets Q3 2026 Kick-Off

    ST brings next-gen Panel-Level Packaging to Tours: $60M pilot line starts Q3-2026, boosting throughput and cutting cost....

    STMicroelectronics' Tour PLP Pilot Line Targets Q3 2026 Kick-Off
  • 2025 / 09 / 29

    ARM Tech's STAR-MC3: Powering Up MCU AI with Innovation

    ARM Technology has launched the third-generation high-energy-efficient embedded chip IP, "Stellar" STAR-MC3, significantly enhancing MCU AI processing capabilities. ...

    ARM Tech's STAR-MC3: Powering Up MCU AI with Innovation
  • 2025 / 09 / 28

    AMD's DDR5 Innovation: HB-DIMM for Next-Level Performance

    AMD's new patent for High Bandwidth Dual In-line Memory Module (HB-DIMM) represents a significant leap in DDR5 memory technology. ...

    AMD's DDR5 Innovation: HB-DIMM for Next-Level Performance
Contact Information
close