AOZ2239QI-02

Introducing AOZ2239QI-02, a cutting-edge and highly efficient synchronous buck regulator that delivers impressive performance and reliability. This advanced integrated circuit is designed to effectively regulate and control voltage levels in a variety of applications, making it an excellent choice for power management solutions. With a wide input voltage range of 2.7V to 5.5V, the AOZ2239QI-02 offers flexibility and versatility for various power supply requirements. It features a high efficiency mode of up to 95%, ensuring minimal power loss and maximum energy efficiency. This makes it ideal for battery-powered devices, portable electronics, industrial equipment, and automotive applications. The AOZ2239QI-02 also boasts a compact and robust design, providing excellent thermal performance and reliability. It incorporates advanced features such as protection against overcurrent, overtemperature, and input undervoltage lockout, ensuring safe and reliable operation in any environment. Additionally, the AOZ2239QI-02 supports adjustable output voltage and a switching frequency range of 1MHz to 3MHz, allowing for easy customization and optimization of power delivery. Its small footprint and low profile make it suitable for space-constrained applications. Experience the power of AOZ2239QI-02 and enjoy efficient power management for your next project.

banner

Other Products

View More
  • Texas Instruments SN74BCT29843DWRG4

    Texas Instruments SN74BCT29843DWRG4

  • Renesas Electronics America Inc 74FCT162374ETPVG8

    Renesas Electronics America Inc 74FCT162374ETPVG8

  • Renesas Electronics America Inc 74FCT162244ATPVG

    Renesas Electronics America Inc 74FCT162244ATPVG

  • Texas Instruments SN74HC241NS

    Texas Instruments SN74HC241NS

  • PMC-Sierra HDMP-0451

    PMC-Sierra HDMP-0451

  • Rochester Electronics, LLC DM7470N

    Rochester Electronics, LLC DM7470N

  • Nexperia USA Inc. 74ABT244DB,112

    Nexperia USA Inc. 74ABT244DB,112

  • NXP USA Inc. 74ABT541D,623

    NXP USA Inc. 74ABT541D,623

  • Texas Instruments SN74LS37N

    Texas Instruments SN74LS37N

  • Harris Corporation HI2-0301/883

    Harris Corporation HI2-0301/883

  • onsemi MC74AC05MELG

    onsemi MC74AC05MELG

  • Texas Instruments SN74LS125ANS

    Texas Instruments SN74LS125ANS

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close