AP4024EYT-HF

Introducing the AP4024EYT-HF, a superior and reliable product designed to meet your power management needs. This product is a high-frequency, synchronous step-down DC-DC converter that delivers exceptional performance in a compact and efficient package. The AP4024EYT-HF is capable of converting input voltages ranging from 4.5V to 18V into a regulated output voltage between 0.6V and 11V. With an output current of up to 4A, this converter offers excellent power handling capabilities for a wide range of applications. Featuring a unique control architecture, the AP4024EYT-HF provides fast transient response and low output voltage ripple, ensuring smooth and stable power supply to your circuits. The integrated protection features such as over-temperature, over-current, and under-voltage lockout safeguards your system from potential damage. The small footprint of the AP4024EYT-HF, combined with its low EMI emissions, makes it ideal for portable and handheld devices where space and power efficiency are paramount. This product is also RoHS compliant, ensuring it meets the highest environmental standards. Trust the AP4024EYT-HF for your power management needs, and experience unmatched performance, reliability, and efficiency.

banner

Other Products

View More
  • 286-1095-ND

    286-1095-ND

  • M0116LD-161LDA2-ND

    M0116LD-161LDA2-ND

  • 286-1102-ND

    286-1102-ND

  • 286-1039-ND

    286-1039-ND

  • CU209-TW200A-ND

    CU209-TW200A-ND

  • 286-1061-ND

    286-1061-ND

  • 286-1090-ND

    286-1090-ND

  • 286-1056-ND

    286-1056-ND

  • 286-1048-ND

    286-1048-ND

  • 286-1030-ND

    286-1030-ND

  • 286-DH2025N-ND

    286-DH2025N-ND

  • M0220SD-202SDAR1-S-ND

    M0220SD-202SDAR1-S-ND

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close