AUIRS2123STRPBF

Introducing the AUIRS2123STRPBF, a high-performance, low-side gate driver designed to drive N-channel Power MOSFETs and IGBTs in a variety of applications. With its compact and robust design, this gate driver offers exceptional efficiency and reliability, making it ideal for use in automotive and industrial applications. Its wide input voltage range of 4.5V to 20V ensures compatibility with a wide range of power supply voltages, making it highly versatile. The AUIRS2123STRPBF also features an internal 8V VCC regulator, eliminating the need for additional external circuitry, saving both space and cost. Its sink and source output currents of 2.8A and 1.8A respectively provide excellent gate drive capabilities, ensuring fast and reliable switching of power devices. Furthermore, its high noise immunity and protection features such as undervoltage lockout, thermal shutdown, and desaturation detection make it highly reliable and protect against potential system failures. In summary, the AUIRS2123STRPBF is a feature-rich, high-performance gate driver that offers superior efficiency, reliability, and versatility for a wide range of applications.

banner

Other Products

View More
  • 711-1751-ND

    711-1751-ND

  • 0701192200-ND

    0701192200-ND

  • 39-12-1A-ND

    39-12-1A-ND

  • 711-2920-ND

    711-2920-ND

  • 711-1687-ND

    711-1687-ND

  • 711-1986-ND

    711-1986-ND

  • 139A-403A-ND

    139A-403A-ND

  • 0410534300-ND

    0410534300-ND

  • 711-1366-ND

    711-1366-ND

  • 1621-1097-ND

    1621-1097-ND

  • 0530994-ND

    0530994-ND

  • 711-2457-ND

    711-2457-ND

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close