CY7C53150-20AXI

Introducing the CY7C53150-20AXI, a high-performance synchronous dual-port static random access memory (SDP SRAM) designed for applications requiring high-speed data transfer with low latency. With a capacity of 256K x 36 bits, this robust memory module offers a flexible solution for a wide range of project requirements. The CY7C53150-20AXI operates at a frequency of 200 MHz, ensuring rapid data processing and reliable performance. The dual-port design facilitates simultaneous access from two separate sources, making it ideal for applications requiring multiple data streams or shared memory access. The SRAM utilizes advanced synchronous technology, enabling precise synchronization with system clocks and reducing the risk of data corruption. Equipped with industry-leading features such as partial array self-refresh and deep power-down mode, the CY7C53150-20AXI optimizes power consumption by dynamically adjusting its power usage based on system requirements. Furthermore, this product is designed to meet the stringent demands of industrial-grade and automotive applications, offering enhanced reliability and resilience in challenging environments. Experience the power, speed, and versatility of the CY7C53150-20AXI, the ultimate memory module for high-performance data processing.

banner

Other Products

View More
  • Texas Instruments PCM2707CPJTR

    Texas Instruments PCM2707CPJTR

  • Asahi Kasei Microdevices/AKM AK4522VM

    Asahi Kasei Microdevices/AKM AK4522VM

  • Analog Devices Inc./Maxim Integrated MAX115CAX+T

    Analog Devices Inc./Maxim Integrated MAX115CAX+T

  • Analog Devices Inc./Maxim Integrated MAX128ACAI+

    Analog Devices Inc./Maxim Integrated MAX128ACAI+

  • Texas Instruments AMC1305M25DWR

    Texas Instruments AMC1305M25DWR

  • Asahi Kasei Microdevices/AKM AK5536VN

    Asahi Kasei Microdevices/AKM AK5536VN

  • Texas Instruments PCM1718E

    Texas Instruments PCM1718E

  • Analog Devices Inc. AD9272BSVZ-40

    Analog Devices Inc. AD9272BSVZ-40

  • Analog Devices Inc. AD2S1210CSTZ

    Analog Devices Inc. AD2S1210CSTZ

  • Analog Devices Inc./Maxim Integrated MAX186AEWP

    Analog Devices Inc./Maxim Integrated MAX186AEWP

  • Texas Instruments PCM1800E/2K

    Texas Instruments PCM1800E/2K

  • Cirrus Logic Inc. CS5346-CQZR

    Cirrus Logic Inc. CS5346-CQZR

Related Blogs

  • 2026 / 08 / 21

    High Voltage Capacitors: Types, Key Parameters, and Selection Guide

    Explore high voltage capacitors, including types, key parameters, applications, and selection guidelines. Learn about MLCC, ceramic, and film capacitor solutions....

    High Voltage Capacitors: Types, Key Parameters, and Selection Guide
  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
Contact Information
close