EPM240GT100C5N

Introducing the EPM240GT100C5N, a cutting-edge programmable logic device that offers exceptional performance and versatility. Designed by industry-leading experts, this product revolutionizes the field of programmable logic devices with its advanced features and capabilities. The EPM240GT100C5N boasts a powerful architecture that allows for high-speed and efficient logic operations. With its ample capacity of 240 logic elements, it can handle even the most complex designs with ease. This device also includes 5,000 logic array blocks and 100 pins, providing ample resources and connectivity options for your applications. Built with reliability in mind, the EPM240GT100C5N utilizes non-volatile memory technology to store your programmable design. This means that your data won't be lost, even in the event of a power failure. With its robust design, this product is suitable for a wide range of applications, including telecommunications, automotive, industrial control, and more. In conclusion, the EPM240GT100C5N is a powerful programmable logic device that offers exceptional capacity, reliability, and performance. Whether you're a professional engineer or an enthusiast, this product is sure to meet and exceed your expectations. Unlock endless possibilities and create a world of innovation with the EPM240GT100C5N.

banner

Other Products

View More
  • 1528-1244-ND

    1528-1244-ND

  • 1568-1893-ND

    1568-1893-ND

  • 2368-69-ELW3.2-OR-ND

    2368-69-ELW3.2-OR-ND

  • 1528-1259-ND

    1528-1259-ND

  • 2368-69-ELW3.2-GR-ND

    2368-69-ELW3.2-GR-ND

  • 1528-1250-ND

    1528-1250-ND

  • DFR0185-LB-ND

    DFR0185-LB-ND

  • 1568-1340-ND

    1568-1340-ND

  • 1528-1232-ND

    1528-1232-ND

  • 1568-1430-ND

    1568-1430-ND

  • 1568-1885-ND

    1568-1885-ND

  • 1568-1682-ND

    1568-1682-ND

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close