EPM3064ATI44-10N

Introducing the EPM3064ATI44-10N, a versatile and high-performance programmable logic device designed to meet the demanding requirements of modern electronic systems. This advanced device combines excellent speed and large capacity to provide optimal solutions for a wide range of applications. The EPM3064ATI44-10N features a fast and efficient 44-pin TQFP package, allowing for easy integration into various circuit designs. With a maximum speed of 10 nanoseconds, this programmable logic device delivers rapid processing capabilities, enabling smooth and seamless operation even in complex systems. This device offers a generous capacity of 64 macrocells, providing abundant resources for the implementation of custom logic functions. It also supports 16 inputs and 16 outputs, ensuring compatibility with diverse input/output configurations. Designed for ease of use, the EPM3064ATI44-10N features an industry-standard JEDEC-compatible fuse map. This simplifies the development process and reduces time to market. Whether you are working on telecommunications, industrial control, or automotive systems, the EPM3064ATI44-10N is the ideal choice for enhancing performance and optimizing efficiency. Experience the power and flexibility of this exceptional programmable logic device today.

banner

Other Products

View More
  • 716-ACCRFCL30BB1-ND

    716-ACCRFCL30BB1-ND

  • 716-ACCRFCOLLRSSD30AAV-ND

    716-ACCRFCOLLRSSD30AAV-ND

  • 5S-10-ND

    5S-10-ND

  • 5904E-ND

    5904E-ND

  • 12S-10-ND

    12S-10-ND

  • 6011E-ND

    6011E-ND

  • 716-ACCRF2EPN-ND

    716-ACCRF2EPN-ND

  • 541-10223-ND

    541-10223-ND

  • 2127E-ND

    2127E-ND

  • 7PA100E-ND

    7PA100E-ND

  • 716-ACCRFCOLLRSO30CAV-ND

    716-ACCRFCOLLRSO30CAV-ND

  • 2126E-ND

    2126E-ND

Related Blogs

  • 2026 / 08 / 21

    High Voltage Capacitors: Types, Key Parameters, and Selection Guide

    Explore high voltage capacitors, including types, key parameters, applications, and selection guidelines. Learn about MLCC, ceramic, and film capacitor solutions....

    High Voltage Capacitors: Types, Key Parameters, and Selection Guide
  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
Contact Information
close