EPM3512AQC208-10N
Introducing the EPM3512AQC208-10N, a high-performance programmable logic device that is designed to meet the demanding requirements of modern digital systems. This device offers a wide range of features and capabilities, making it suitable for a variety of applications including telecommunications, consumer electronics, and industrial automation. The EPM3512AQC208-10N offers 512 macrocells, providing ample space for implementing complex digital designs. It also features 10ns maximum propagation delay, ensuring fast and reliable operation. The device operates at a voltage range of 2.5V to 3.3V, making it compatible with a wide range of digital systems. With its high speed and low power consumption, the EPM3512AQC208-10N is an ideal choice for applications that require both performance and efficiency. It also offers a comprehensive design software solution, allowing users to easily program and implement their desired functionality. Overall, the EPM3512AQC208-10N offers a powerful and versatile solution for digital system design. Its high-performance capabilities and easy-to-use design software make it an excellent choice for a wide range of applications.
Other Products
View More-
Power Integrations INN4074C-H182-TL
-
Power Integrations TOP264KG
-
NXP USA Inc. TEA1530T/N2,118
-
Power Integrations LNK6665K-TL
-
Power Integrations LNK562PG
-
Renesas Design Germany GmbH IW1796-02
-
Renesas Design Germany GmbH IW1706-01
-
Texas Instruments UCC25706D
-
NXP USA Inc. TEA1733CT/N1,118
-
onsemi FAN6300DZ
-
Monolithic Power Systems Inc. HF920GSE-Z
-
Texas Instruments UC3851DW
Related Blogs
-
2026 / 08 / 20
Marvell and Google Forge Strategic Partnership in Custom Product
Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...
-
2026 / 08 / 19
Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....
-
2026 / 08 / 18
Amkor Plans Spin-off of China Packaging and Testing Business
Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....
-
2026 / 08 / 17
Accelerated Exit: Nokia to Close Hangzhou R&D Center
Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...
-
2026 / 08 / 13
IBM and Together AI Sign $240 Million Agreement
IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....
-
2026 / 08 / 12
Intel Raises $15 Billion to Accelerate Chip Manufacturing
Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....
-
2026 / 08 / 11
Teledyne to Acquire Varex Imaging for $1.1 Billion
Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....
-
2026 / 08 / 10
SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....
-
2026 / 08 / 07
TI TPSM Series Power Modules – Selection Guide
TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....
-
2026 / 08 / 06
All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....
