EPM7064AELI44-7

Introducing the EPM7064AELI44-7, an exceptional product designed to cater to the advanced technological needs of modern industries. This powerful programmable logic device (PLD) offers a range of incredible features that make it an ideal choice for applications requiring high-performance and flexibility. The EPM7064AELI44-7 boasts a generous capacity of 64 macrocells, offering ample room for complex designs and applications. Its innovative architecture supports various configurations, including combinatorial, sequential, and registered logic circuits, allowing for versatile functionality. With a superior speed of 7ns and a wide operating voltage range, this PLD can deliver exceptional performance even under challenging conditions. Additionally, the EPM7064AELI44-7 features built-in security measures to ensure the integrity of your designs. Its non-volatile memory cells retain data without the need for continuous power supply, safeguarding your work against unexpected power outages or system failures. The EPM7064AELI44-7 is compatible with industry-standard development tools, making it easy to integrate into existing design environments. With its exceptional performance, advanced features, and compatibility, this PLD is the perfect solution to meet the evolving demands of today's rapidly developing industries.

banner

Other Products

View More
  • Texas Instruments BQ24002PWP

    Texas Instruments BQ24002PWP

  • Analog Devices Inc./Maxim Integrated MAX14676BEWO+

    Analog Devices Inc./Maxim Integrated MAX14676BEWO+

  • Texas Instruments BQ2057WSN

    Texas Instruments BQ2057WSN

  • Analog Devices Inc./Maxim Integrated MAX1879EUA+

    Analog Devices Inc./Maxim Integrated MAX1879EUA+

  • Analog Devices Inc. LTC4080EDD#PBF

    Analog Devices Inc. LTC4080EDD#PBF

  • Torex Semiconductor Ltd XC6806A395DR-G

    Torex Semiconductor Ltd XC6806A395DR-G

  • Microchip Technology MCP73827-4.1VUATR

    Microchip Technology MCP73827-4.1VUATR

  • Torex Semiconductor Ltd XC6808B3E48R-G

    Torex Semiconductor Ltd XC6808B3E48R-G

  • Renesas Electronics America Inc ISL95871CHRZ-T

    Renesas Electronics America Inc ISL95871CHRZ-T

  • Skyworks Solutions Inc. AAT4681IDE-T1

    Skyworks Solutions Inc. AAT4681IDE-T1

  • Analog Devices Inc. LTC4009IUF#PBF

    Analog Devices Inc. LTC4009IUF#PBF

  • Analog Devices Inc. LT3651IUHE-8.2#PBF

    Analog Devices Inc. LT3651IUHE-8.2#PBF

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close