EPM7064AETC447N

Introducing the EPM7064AETC447N, a powerful programmable logic device (PLD) from our esteemed line of high-performance products. This innovative solution is designed to enhance the flexibility and functionality of your digital systems, making it ideal for a wide range of applications including telecommunications, industrial automation, and consumer electronics. Featuring a robust architecture, the EPM7064AETC447N combines a versatile programmable logic array (PLA) with programmable input/output (PIO) blocks, providing unprecedented control and customization. With its advanced flash technology, this PLD delivers lightning-fast programming times and superior performance. The EPM7064AETC447N offers an impressive capacity of 64 macrocells, allowing for intricate logic designs and complex operations. Its low power consumption ensures reduced energy costs and increased efficiency, while the built-in security features safeguard your intellectual property. Designed for ease of use, the EPM7064AETC447N is supported by our industry-leading development tools and software, making the design and implementation process seamless. Our dedicated technical support team is also available to assist you every step of the way. Upgrade your digital systems with the EPM7064AETC447N PLD and unlock a new level of performance and versatility. Experience the difference today.

banner

Other Products

View More
  • Renesas Electronics America Inc ISL83078EIUZA-T

    Renesas Electronics America Inc ISL83078EIUZA-T

  • Texas Instruments TCAN1051HDRBR

    Texas Instruments TCAN1051HDRBR

  • Renesas Electronics America Inc EL1517BILZ-T7

    Renesas Electronics America Inc EL1517BILZ-T7

  • Texas Instruments DP83848NRTAR

    Texas Instruments DP83848NRTAR

  • Renesas Electronics America Inc EL1528CRE-T13

    Renesas Electronics America Inc EL1528CRE-T13

  • Texas Instruments 34P3410DCA

    Texas Instruments 34P3410DCA

  • Intersil HIN211EIA-T

    Intersil HIN211EIA-T

  • National Semiconductor DS481M

    National Semiconductor DS481M

  • Texas Instruments TLK2701IRCPG4

    Texas Instruments TLK2701IRCPG4

  • Analog Devices Inc. ADM232LARZ-REEL

    Analog Devices Inc. ADM232LARZ-REEL

  • Renesas Electronics America Inc EL1509CSZ

    Renesas Electronics America Inc EL1509CSZ

  • Harris Corporation HIN232IB

    Harris Corporation HIN232IB

Related Blogs

  • 2026 / 08 / 21

    High Voltage Capacitors: Types, Key Parameters, and Selection Guide

    Explore high voltage capacitors, including types, key parameters, applications, and selection guidelines. Learn about MLCC, ceramic, and film capacitor solutions....

    High Voltage Capacitors: Types, Key Parameters, and Selection Guide
  • 2026 / 08 / 20

    Marvell and Google Forge Strategic Partnership in Custom Product

    Google diversifies its AI chip strategy via a custom semiconductor partnership with Marvell, spanning inference accelerators and networking silicon ...

    Marvell and Google Forge Strategic Partnership in Custom Product
  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
Contact Information
close