EPM7128ATC100-10

Introducing the EPM7128ATC100-10, a versatile and powerful programmable logic device designed to meet the demanding requirements of the modern digital design industry. Developed by a renowned semiconductor manufacturer, this device offers a unique combination of performance, flexibility, and reliability. Featuring 128 macrocells and 10 ns pin-to-pin delays, the EPM7128ATC100-10 provides ample resources and fast operation for a wide range of applications. Its high-speed architecture ensures efficient data transfer, facilitating smooth operation in complex designs. This programmable logic device is programmed using industry-standard hardware programming languages such as VHDL and Verilog, making it compatible with various design tools and workflows. It also supports in-system programming, allowing for easy updates and modifications without the need for hardware replacement. In addition to its technical capabilities, the EPM7128ATC100-10 is designed with a robust package to ensure durability and longevity. Its small form factor and low power consumption make it suitable for a wide range of applications, from consumer electronics to industrial control systems. Overall, the EPM7128ATC100-10 is an exceptional programmable logic device that offers unbeatable performance, flexibility, and reliability. It is the ideal solution for designers seeking a high-quality, versatile device for their digital design projects.

banner

Other Products

View More
  • Analog Devices Inc./Maxim Integrated MAX7315AUE+

    Analog Devices Inc./Maxim Integrated MAX7315AUE+

  • Texas Instruments PCA9534ADB

    Texas Instruments PCA9534ADB

  • Texas Instruments PCA9535PW

    Texas Instruments PCA9535PW

  • Renesas Electronics America Inc CQ82C55A

    Renesas Electronics America Inc CQ82C55A

  • Texas Instruments PCA9535PWR

    Texas Instruments PCA9535PWR

  • Microchip Technology MCP25055-I/P

    Microchip Technology MCP25055-I/P

  • Diodes Incorporated PI4IOE5V9535LEX

    Diodes Incorporated PI4IOE5V9535LEX

  • SMSC LPC47M287-NR

    SMSC LPC47M287-NR

  • Texas Instruments PCA9539PWRG4

    Texas Instruments PCA9539PWRG4

  • Renesas Electronics America Inc CS82C55A-596

    Renesas Electronics America Inc CS82C55A-596

  • Texas Instruments PCA9538DB

    Texas Instruments PCA9538DB

  • onsemi PCA9535EDWR2G

    onsemi PCA9535EDWR2G

Related Blogs

  • 2026 / 08 / 19

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026

    ST issues third 2026 price hike, with product lines rising August 23. Barely four months since the last adjustment....

    Supply Chain Cost Pressures Mount, ST Third Price Hike of 2026
  • 2026 / 08 / 18

    Amkor Plans Spin-off of China Packaging and Testing Business

    Amkor plans to spin off its China packaging unit, selling a majority stake valued at $1–1.5B. It Still in early stages....

    Amkor Plans Spin-off of China Packaging and Testing Business
  • 2026 / 08 / 17

    Accelerated Exit: Nokia to Close Hangzhou R&D Center

    Nokia accelerates its China exit with the closure of its Hangzhou R&D center, cutting 1,600 jobs. ...

    Accelerated Exit: Nokia to Close Hangzhou R&D Center
  • 2026 / 08 / 13

    IBM and Together AI Sign $240 Million Agreement

    IBM and Together AI ink a $240M deal to deploy a NVIDIA Blackwell-powered open-source AI inference cluster on IBM Cloud....

    IBM and Together AI Sign $240 Million Agreement
  • 2026 / 08 / 12

    Intel Raises $15 Billion to Accelerate Chip Manufacturing

    Intel raises $15B for AI silicon and manufacturing. It targets 18A/14A nodes, advanced packaging, and foundry growth....

    Intel Raises $15 Billion to Accelerate Chip Manufacturing
  • 2026 / 08 / 11

    Teledyne to Acquire Varex Imaging for $1.1 Billion

    Teledyne's $1.1 billion acquisition of Varex Imaging unites complementary X-ray technologies, strengthening its healthcare position....

    Teledyne to Acquire Varex Imaging for $1.1 Billion
  • 2026 / 08 / 10

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs

    SK Hynix commits 54 trillion won to build Yongin Y2 and Cheongju M17 fabs. The investment targets HBM and NAND to meet soaring AI demand....

    SK Hynix Invests 54 Trillion Won to Expand Yongin Y2 and Cheongju M17 Fabs
  • 2026 / 08 / 07

    TI TPSM Series Power Modules – Selection Guide

    TI TPSM modules integrate controller, MOSFETs, inductor, and passives in a single package. ust add caps – no loop design. Ideal for industrial, auto, telecom....

    TI TPSM Series Power Modules – Selection Guide
  • 2026 / 08 / 06

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out

    Ccrisis intensifies: 2027 all DRAM/HBM capacity sold out by top 3 makers. AI GPU demand surges, NAND tightens through 2028....

    All Three Major DRAM Manufacturers' 2027 Capacity Fully Sold Out
  • 2026 / 08 / 05

    SK hynix And Sandisk Release HBF First Standard Specification

    SK hynix and SanDisk unveiled the first HBF standard via OCP, with up to 512GB and 3.0TB/s. This open spec bridges HBM and SSDs to tackle AI memory bottlenecks....

    SK hynix And Sandisk Release HBF First Standard Specification
Contact Information
close